Compact and lightweight, High breakdown voltage, Surface mounting type# EE23TNUN Technical Documentation
## 1. Application Scenarios
### Typical Use Cases
The EE23TNUN is a high-frequency ferrite core transformer primarily employed in switch-mode power supplies (SMPS) operating in the 100-500 kHz range. Common implementations include:
- Forward converter topologies for medium-power applications (50-150W)
- Flyback converters in compact power supply designs
- DC-DC converter isolation stages requiring high voltage separation
- Gate drive circuits for power MOSFETs and IGBTs
### Industry Applications
Telecommunications Equipment:
- Base station power supplies
- Network switch power modules
- Fiber optic transceiver power circuits
Industrial Electronics:
- PLC (Programmable Logic Controller) power sections
- Motor drive control circuits
- Industrial automation power supplies
Consumer Electronics:
- LCD/LED television power boards
- Desktop computer ATX power supplies
- Gaming console power adapters
### Practical Advantages and Limitations
Advantages:
- High saturation flux density (480 mT at 100°C) enables compact design
- Low core loss (≤120 mW/cm³ at 100 kHz, 200 mT) improves efficiency
- Excellent temperature stability (-40°C to +120°C operating range)
- Good EMI suppression due to closed magnetic structure
Limitations:
- Limited to medium frequency range - performance degrades above 500 kHz
- Moderate permeability requires careful winding design for optimal performance
- Mechanical fragility - requires proper mounting to prevent core damage
- Limited customization - standard bobbins may not suit all applications
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Core Saturation Issues:
- Pitfall: Inadequate current handling leading to core saturation
- Solution: Implement proper current limiting and use N+1 margin in primary turns calculation
Thermal Management:
- Pitfall: Overheating due to poor ventilation and high core losses
- Solution: Maintain 2-3mm clearance from heat-generating components and use thermal vias in PCB
Winding Insulation:
- Pitfall: Insulation breakdown in high-voltage applications
- Solution: Use triple-insulated wire for secondary windings and maintain 8mm creepage distance
### Compatibility Issues
Semiconductor Compatibility:
- MOSFET Drivers: Compatible with most gate drive ICs (IR2110, TLP250 series)
- Controller ICs: Optimal with current-mode controllers (UC384x, SG3525 families)
- Incompatibility: Avoid use with voltage-fed resonant converters without design modification
Passive Component Considerations:
- Output Capacitors: Low-ESR electrolytic or ceramic capacitors recommended
- Input Filters: Requires proper LC filtering to suppress switching noise
- Snubber Circuits: RC snubbers essential for voltage spike suppression
### PCB Layout Recommendations
Primary-Side Layout:
- Keep high-frequency switching traces ≤20mm in length
- Place input capacitors within 10mm of transformer pins
- Use ground plane for noise suppression but avoid under transformer core
Secondary-Side Layout:
- Implement star grounding for output returns
- Route high-current secondary traces with ≥2oz copper weight
- Maintain 3mm clearance between primary and secondary circuits
General Guidelines:
- Use vias for heat dissipation from center tap
- Implement guard rings around high-voltage pins
- Place test points for key waveforms (gate drive, output voltage)
## 3. Technical Specifications
### Key Parameter Explanations
Core Characteristics:
- Material: PC44 ferrite (Mn-Zn)
- Effective Cross-Section (A
