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EC2-4.5TNU from NEC

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EC2-4.5TNU

Manufacturer: NEC

COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE

Partnumber Manufacturer Quantity Availability
EC2-4.5TNU,EC245TNU NEC 149 In Stock

Description and Introduction

COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE The part **EC2-4.5TNU** is manufactured by **NEC (NEC Tokin)**. Below are the factual specifications from Ic-phoenix technical data files:  

- **Type**: Tantalum Capacitor  
- **Capacitance**: 4.7 µF (microfarads)  
- **Voltage Rating**: 4 V (DC)  
- **Tolerance**: ±20%  
- **Package/Case**: EC2 (SMD/SMT, 2-pin)  
- **ESR (Equivalent Series Resistance)**: Typically 3 Ω (ohms)  
- **Operating Temperature Range**: -55°C to +125°C  
- **Polarity**: Polarized (requires correct orientation)  
- **Termination**: Surface Mount (SMD)  

This capacitor is commonly used in power supply filtering, decoupling, and signal conditioning applications in electronic circuits.  

(Note: Always verify with the latest datasheet from NEC for precise specifications.)

Application Scenarios & Design Considerations

COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE# EC245TNU Technical Documentation

## 1. Application Scenarios

### Typical Use Cases
The EC245TNU serves as a  high-frequency RF transistor  optimized for  VHF/UHF applications  (30 MHz to 3 GHz). Common implementations include:

-  Low-noise amplifiers (LNAs)  in receiver front-ends
-  Driver stages  for RF power amplifiers
-  Oscillator circuits  in frequency synthesizers
-  Mixer local oscillator (LO) buffers 
-  Cellular infrastructure  transceiver modules

### Industry Applications
 Telecommunications: 
-  Base station equipment  - Used in receiver chains for signal amplification
-  Microwave radio links  - Employed in point-to-point communication systems
-  Satellite communication  terminals - Functions in downconverter stages

 Industrial Electronics: 
-  RF test equipment  - Implemented in signal generator output stages
-  Wireless sensor networks  - Powers long-range IoT communication modules
-  Radar systems  - Used in low-power transmitter sections

 Consumer Electronics: 
-  Set-top boxes  - Enhances satellite receiver sensitivity
-  Wireless routers  - Improves 5GHz band performance
-  Two-way radios  - Boosts receiver sensitivity in commercial walkie-talkies

### Practical Advantages and Limitations

 Advantages: 
-  Low noise figure  (1.2 dB typical at 900 MHz)
-  High gain  (15 dB typical at 2 GHz)
-  Excellent linearity  (OIP3: +25 dBm typical)
-  Wide bandwidth  operation (DC to 3 GHz)
-  Robust ESD protection  (2 kV HBM)

 Limitations: 
-  Limited power handling  (P1dB: +15 dBm maximum)
-  Thermal sensitivity  - Requires careful thermal management above +85°C
-  Supply voltage constraints  (3.3V ±10% operating range)
-  Sensitivity to impedance mismatches  beyond 2:1 VSWR

## 2. Design Considerations

### Common Design Pitfalls and Solutions

 Pitfall 1: Oscillation in High-Gain Configurations 
-  Problem:  Unwanted oscillations at frequencies > 2.5 GHz
-  Solution:  Implement  ferrite beads  in bias lines and use  RF chokes  with proper self-resonant frequency characteristics

 Pitfall 2: Thermal Runaway 
-  Problem:  Current hogging in parallel configurations
-  Solution:  Include  emitter degeneration resistors  (2.2-4.7Ω) and ensure adequate heatsinking

 Pitfall 3: Gain Compression at High Temperatures 
-  Problem:  3 dB gain reduction at +105°C junction temperature
-  Solution:  Derate output power by 20% for continuous operation above +70°C ambient

### Compatibility Issues

 Matching Components: 
- Requires  DC-blocking capacitors  with low ESR (<0.1Ω) at RF frequencies
-  Bias tees  must handle DC current up to 80 mA without saturation
-  RF chokes  should have self-resonant frequency > 3× operating frequency

 Digital Control Interfaces: 
-  Incompatible  with 5V logic levels - requires level shifting
-  Sensitive to power sequencing  - RF ports should be powered after bias

### PCB Layout Recommendations

 RF Signal Path: 
- Use  coplanar waveguide  with ground for 50Ω impedance matching
- Maintain  minimum trace lengths  between matching components
- Implement  ground vias  every λ/10 at highest operating frequency

 Power Supply Decoupling: 
- Place  100 pF ceramic capacitors  within 1 mm of supply pins
-

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