WOUND CHIP INDUCTORS # Technical Documentation: CBC3225T3R3MR Multilayer Ceramic Capacitor (MLCC)
Manufacturer : TAI (Taiyo Yuden)
Component Type : Multilayer Ceramic Capacitor (MLCC)
Package : 3225 (3216 metric) [3.2mm × 2.5mm]
Value : 3.3nF (0.0033µF) ±20%
Temperature Characteristic : X7R
Rated Voltage : 25V DC
Termination : Matte Tin (RoHS compliant)
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## 1. Application Scenarios
### Typical Use Cases
The CBC3225T3R3MR is primarily employed in bypass/decoupling applications for digital ICs, particularly for:
- Power supply filtering for microcontrollers, FPGAs, and ASICs
- High-frequency noise suppression in switching power circuits
- AC coupling in RF and communication circuits
- Timing circuits where moderate temperature stability is acceptable
### Industry Applications
- Consumer Electronics : Smartphones, tablets, wearables for power management
- Telecommunications : Base stations, network equipment for signal conditioning
- Automotive Electronics : Infotainment systems, ECUs (non-safety critical)
- Industrial Control : PLCs, motor drives, power supplies
- Medical Devices : Patient monitoring equipment, diagnostic instruments
### Practical Advantages
- Compact size : 3225 package offers excellent capacitance density
- X7R dielectric : Provides stable performance across -55°C to +125°C range
- Low ESR : Suitable for high-frequency applications up to several MHz
- RoHS compliance : Environmentally friendly manufacturing
- Cost-effective : Competitive pricing for medium-performance applications
### Limitations
- Capacitance tolerance : ±20% may be insufficient for precision analog circuits
- DC bias effect : Capacitance decreases with applied DC voltage (typical of X7R)
- Microphonics : May exhibit piezoelectric effects in high-vibration environments
- Aging characteristic : X7R dielectric loses approximately 2.5% capacitance per decade hour
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## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: DC Bias Derating
- Issue : Significant capacitance loss at rated voltage
- Solution : Derate operating voltage to 50-70% of rated voltage for stable performance
Pitfall 2: Thermal Stress Cracking
- Issue : Mechanical cracks from PCB flexure or thermal cycling
- Solution :
- Maintain minimum distance from board edges (≥3mm)
- Orient capacitor perpendicular to board bending axis
- Use symmetric pad design to distribute stress
Pitfall 3: Acoustic Noise
- Issue : Audible noise from piezoelectric effects in audio circuits
- Solution : Use COG/NP0 capacitors for sensitive audio applications
### Compatibility Issues
- Mixed Dielectrics : Avoid parallel connection with different dielectric types (X7R with Y5V) due to varying temperature coefficients
- Voltage Rating Mismatch : Do not series-connect capacitors with different voltage ratings without proper voltage balancing
- ESL Considerations : May interact with high-speed digital circuits; consider lower-inductance alternatives for >100MHz applications
### PCB Layout Recommendations
Placement Strategy :
- Position as close as possible to IC power pins (≤5mm ideal)
- Use multiple capacitors in parallel for broadband decoupling
- Maintain equal trace lengths for balanced current distribution
Routing Guidelines :
- Use wide, short traces to minimize parasitic inductance
- Implement solid ground planes beneath capacitors
- Avoid vias between capacitor and IC power pins when possible
Thermal Management :
- Provide adequate
