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CY7C1565KV18-450BZC from CYPRESS

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CY7C1565KV18-450BZC

Manufacturer: CYPRESS

72-Mbit QDR II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency)

Partnumber Manufacturer Quantity Availability
CY7C1565KV18-450BZC,CY7C1565KV18450BZC CYPRESS 30 In Stock

Description and Introduction

72-Mbit QDR II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency) The CY7C1565KV18-450BZC is a high-performance synchronous pipelined SRAM manufactured by Cypress Semiconductor. Below are its key specifications:

- **Type**: Synchronous Pipelined SRAM  
- **Density**: 36 Mb (1M x 36)  
- **Speed**: 450 MHz  
- **Voltage**: 1.8V ±5%  
- **Organization**: 1,048,576 words × 36 bits  
- **Access Time**: 2.2 ns (max)  
- **I/O Type**: HSTL (High-Speed Transceiver Logic)  
- **Package**: 165-ball BGA (Ball Grid Array)  
- **Operating Temperature**: Commercial (0°C to +70°C)  
- **Features**:  
  - Byte Write capability  
  - Burst mode operation  
  - On-chip address and data pipelining  
  - Single-cycle deselect  
  - JTAG boundary scan support  

This SRAM is designed for high-speed networking, telecommunications, and other performance-critical applications.

Partnumber Manufacturer Quantity Availability
CY7C1565KV18-450BZC,CY7C1565KV18450BZC CY 27 In Stock

Description and Introduction

72-Mbit QDR II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency) The CY7C1565KV18-450BZC is a high-performance synchronous pipelined SRAM manufactured by Cypress Semiconductor (now Infineon Technologies). Here are its key specifications:

- **Density**: 36 Mb (2M x 18)
- **Speed**: 450 MHz (2.2 ns clock-to-output)
- **Voltage Supply**: 1.8V (±5%)
- **Organization**: 2,097,152 words × 18 bits
- **Interface**: Synchronous pipelined with ZQ (impedance calibration)
- **Package**: 165-ball BGA (Ball Grid Array)
- **Operating Temperature**: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C)
- **Features**:
  - Supports burst operations (linear or interleaved)
  - On-die termination (ODT)
  - Single-cycle deselect
  - Byte write control
  - JTAG boundary scan (IEEE 1149.1 compliant)
  - HSTL (1.8V) I/O interface
  - 3-chip enable signals for depth expansion
  - Sleep mode for reduced power consumption

This device is designed for high-speed networking, telecommunications, and other performance-critical applications.

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