IC Phoenix logo

Home ›  C  › C46 > CY7C1514KV18-250BZC

CY7C1514KV18-250BZC from CY,Cypress

Fast Delivery, Competitive Price @IC-phoenix

If you need more electronic components or better pricing, we welcome any inquiry.

0.000ms

CY7C1514KV18-250BZC

Manufacturer: CY

72-Mbit QDR?II SRAM Two-Word Burst Architecture

Partnumber Manufacturer Quantity Availability
CY7C1514KV18-250BZC,CY7C1514KV18250BZC CY 12 In Stock

Description and Introduction

72-Mbit QDR?II SRAM Two-Word Burst Architecture The CY7C1514KV18-250BZC is a high-performance synchronous pipelined SRAM manufactured by Cypress Semiconductor (now Infineon Technologies). Here are its key specifications:

- **Type**: Synchronous Pipelined SRAM  
- **Density**: 72-Mbit (4M × 18)  
- **Speed**: 250 MHz (4 ns clock-to-data access)  
- **Voltage Supply**: 1.8V (VDD) ±5%  
- **I/O Voltage**: 1.5V (VDDQ) ±5%  
- **Organization**: 4,194,304 words × 18 bits  
- **Interface**: HSTL (High-Speed Transceiver Logic)  
- **Package**: 165-ball BGA (Ball Grid Array)  
- **Operating Temperature**: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C)  
- **Features**:  
  - Pipelined operation for high-speed applications  
  - Byte write control (Upper/Lower byte select)  
  - Single-cycle deselect for reduced power consumption  
  - JTAG boundary scan support  
  - On-chip address and data pipeline registers  
  - Burst mode support (Linear or Interleaved)  

This SRAM is designed for networking, telecommunications, and high-performance computing applications.

Partnumber Manufacturer Quantity Availability
CY7C1514KV18-250BZC,CY7C1514KV18250BZC CYPRESS 32 In Stock

Description and Introduction

72-Mbit QDR?II SRAM Two-Word Burst Architecture The CY7C1514KV18-250BZC is a high-performance synchronous pipelined SRAM manufactured by Cypress Semiconductor. Below are its key specifications:

1. **Memory Type**: Synchronous Pipelined SRAM  
2. **Density**: 18 Mb (1M x 18)  
3. **Speed**: 250 MHz  
4. **Voltage Supply**: 1.8V (VDD) and 1.5V (VDDQ)  
5. **Organization**: 1,048,576 words × 18 bits  
6. **Access Time**: 3.6 ns (max)  
7. **I/O Type**: HSTL (High-Speed Transceiver Logic)  
8. **Package**: 165-ball FBGA (Fine-Pitch Ball Grid Array)  
9. **Operating Temperature**: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C)  
10. **Features**:  
   - Pipelined operation for high-speed applications  
   - Byte write capability  
   - On-chip address and control registers  
   - JTAG boundary scan support  
   - ZZ (sleep mode) power-down feature  

This device is designed for networking, telecommunications, and high-performance computing applications.

Request Quotation

For immediate assistance, call us at +86 533 2716050 or email [email protected]

Part Number Quantity Target Price($USD) Email Contact Person
We offer highly competitive channel pricing. Get in touch for details.

Specializes in hard-to-find components chips