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CY7C1472V33-200AXC from CYPRESS

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CY7C1472V33-200AXC

Manufacturer: CYPRESS

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture

Partnumber Manufacturer Quantity Availability
CY7C1472V33-200AXC,CY7C1472V33200AXC CYPRESS 25 In Stock

Description and Introduction

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture The CY7C1472V33-200AXC is a high-speed synchronous pipelined SRAM manufactured by Cypress Semiconductor. Here are its key specifications:

- **Type**: Synchronous Pipelined SRAM  
- **Density**: 72-Mbit (4M x 18)  
- **Speed**: 200 MHz  
- **Voltage Supply**: 3.3V  
- **Organization**: 4,194,304 words × 18 bits  
- **Access Time**: 3.5 ns (max)  
- **I/O Type**: Common I/O  
- **Package**: 100-ball TQFP (Thin Quad Flat Pack)  
- **Operating Temperature**: Commercial (0°C to +70°C)  
- **Features**:  
  - Byte Write capability  
  - Burst mode operation  
  - Single-cycle deselect  
  - JTAG boundary scan  
  - ZZ sleep mode for power saving  

This information is based on the manufacturer's datasheet. For detailed specifications, refer to Cypress's official documentation.

Partnumber Manufacturer Quantity Availability
CY7C1472V33-200AXC,CY7C1472V33200AXC CY 37 In Stock

Description and Introduction

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture The CY7C1472V33-200AXC is a high-speed synchronous pipelined SRAM manufactured by Cypress Semiconductor (now Infineon Technologies). Here are the key specifications:

- **Type**: Synchronous Pipelined SRAM
- **Density**: 72-Mbit (4M x 18)
- **Speed**: 200 MHz
- **Operating Voltage**: 3.3V
- **Organization**: 4,194,304 words × 18 bits
- **Access Time**: 3.5 ns (clock-to-data)
- **Package**: 165-ball FBGA (Fine-pitch Ball Grid Array)
- **Interface**: HSTL (High-Speed Transceiver Logic)
- **Operating Temperature**: Commercial (0°C to +70°C)
- **Features**: 
  - Burst mode operation
  - Byte write capability
  - Single-cycle deselect
  - JTAG boundary scan (IEEE 1149.1 compliant)

This SRAM is commonly used in networking, telecommunications, and high-performance computing applications.

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