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CY7C1370CV25-200BZC from CY,Cypress

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15.625ms

CY7C1370CV25-200BZC

Manufacturer: CY

512K x 36/1M x 18 Pipelined SRAM with NoBL(TM) Architecture

Partnumber Manufacturer Quantity Availability
CY7C1370CV25-200BZC,CY7C1370CV25200BZC CY 25 In Stock

Description and Introduction

512K x 36/1M x 18 Pipelined SRAM with NoBL(TM) Architecture The CY7C1370CV25-200BZC is a high-speed synchronous pipelined SRAM manufactured by Cypress Semiconductor (now part of Infineon Technologies). Here are its key specifications:

- **Type**: Synchronous Pipelined SRAM  
- **Density**: 4 Mbit (256K x 18)  
- **Speed**: 200 MHz (5 ns clock-to-data access)  
- **Voltage**: 2.5V ±5% (VDD)  
- **I/O Voltage**: 2.5V (VDDQ)  
- **Organization**: 256K words × 18 bits  
- **Package**: 165-ball FBGA (BZC)  
- **Operating Temperature**: Commercial (0°C to +70°C)  
- **Interface**: HSTL (High-Speed Transceiver Logic)  
- **Burst Modes**: Linear or Interleaved  
- **Pipeline Stages**: Two-stage output pipeline  
- **Features**:  
  - Single-cycle deselect  
  - Byte Write Control  
  - ZZ (Sleep Mode) for power saving  
  - JTAG Boundary Scan (IEEE 1149.1 compliant)  

This device is designed for high-performance networking and telecommunications applications.

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