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CHL8112B-00CRT from CHIL

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CHL8112B-00CRT

Manufacturer: CHIL

Dual Loop, 4+1 multiphase AMD PWM controller for high efficiency, highly accurate VR solutions

Partnumber Manufacturer Quantity Availability
CHL8112B-00CRT,CHL8112B00CRT CHIL 11 In Stock

Description and Introduction

Dual Loop, 4+1 multiphase AMD PWM controller for high efficiency, highly accurate VR solutions The part CHL8112B-00CRT is manufactured by CHIL (Chilisin Electronics). Here are the specifications from Ic-phoenix technical data files:

1. **Manufacturer**: CHIL (Chilisin Electronics)  
2. **Part Number**: CHL8112B-00CRT  
3. **Type**: Inductor (Power Inductor)  
4. **Inductance**: 10 µH (±20%)  
5. **Current Rating**: 1.2 A (Saturation Current)  
6. **DC Resistance (DCR)**: 0.35 Ω (Typical)  
7. **Operating Temperature Range**: -40°C to +125°C  
8. **Package/Size**: 4.5 x 4.0 x 2.0 mm (L x W x H)  
9. **Shielding**: Shielded  
10. **Applications**: Power supplies, DC-DC converters  

No additional suggestions or guidance are provided.

Application Scenarios & Design Considerations

Dual Loop, 4+1 multiphase AMD PWM controller for high efficiency, highly accurate VR solutions# CHL8112B00CRT Technical Documentation

## 1. Application Scenarios

### Typical Use Cases
The CHL8112B00CRT is a high-performance  DC-DC buck converter IC  primarily designed for  power management applications  in modern electronic systems. Typical implementations include:

-  Voltage regulation  for microprocessor cores and digital logic circuits
-  Battery-powered device  power conversion (3.3V/5V/12V systems)
-  Industrial automation  control system power supplies
-  Embedded computing  platforms requiring efficient power delivery

### Industry Applications
 Consumer Electronics: 
- Smartphone power management subsystems
- Tablet and laptop internal power rails
- Portable gaming devices and wearables

 Industrial Systems: 
- PLC (Programmable Logic Controller) power modules
- Motor control system auxiliary power
- Sensor network power distribution nodes

 Automotive Electronics: 
- Infotainment system power regulation
- Advanced driver assistance systems (ADAS)
- Telematics control unit power supplies

 Telecommunications: 
- Network switch/router power management
- Base station auxiliary power conversion
- Fiber optic transceiver power regulation

### Practical Advantages and Limitations

 Advantages: 
-  High efficiency  (up to 95% at typical loads)
-  Wide input voltage range  (4.5V to 28V)
-  Compact package  (QFN-16, 3×3mm)
-  Excellent thermal performance  with exposed thermal pad
-  Integrated protection features  (over-current, over-temperature, under-voltage lockout)

 Limitations: 
-  Maximum output current  limited to 3A continuous
-  External compensation network  required for stability
-  Limited to step-down conversion  only
-  Sensitive to PCB layout  for optimal performance

## 2. Design Considerations

### Common Design Pitfalls and Solutions

 Pitfall 1: Inadequate Input Capacitor Selection 
-  Problem:  Input voltage ripple exceeding specifications
-  Solution:  Use low-ESR ceramic capacitors (X7R/X5R) close to VIN pin
-  Recommendation:  Minimum 22µF ceramic + 10µF ceramic in parallel

 Pitfall 2: Improper Inductor Selection 
-  Problem:  Excessive output ripple or instability
-  Solution:  Select inductor with appropriate saturation current and DCR
-  Calculation:  L = (VIN - VOUT) × VOUT / (VIN × fSW × ΔIL)

 Pitfall 3: Thermal Management Issues 
-  Problem:  Premature thermal shutdown
-  Solution:  Ensure proper thermal vias under exposed pad
-  Implementation:  4×4 array of 8mil vias connecting to ground plane

### Compatibility Issues with Other Components

 Digital Interface Compatibility: 
-  PWM input  compatible with 3.3V logic levels
-  Power-good output  requires pull-up resistor to host system voltage
-  Soft-start timing  must align with system power sequencing requirements

 Analog Signal Interference: 
-  Switching noise  may affect sensitive analog circuits
-  Mitigation:  Physical separation and proper grounding techniques
-  Recommendation:  Maintain 10mm minimum distance from sensitive analog ICs

### PCB Layout Recommendations

 Power Stage Layout: 
```
[VIN Caps] → [IC VIN Pin] → [IC GND] → [Inductor] → [VOUT Caps]
    ↓              ↓            ↓          ↓           ↓
 <10mm         Direct       Thermal     <5mm       <5mm
               connect       vias                  to load
```

 Critical Routing Guidelines: 
-  Keep power traces short and wide  (minimum 20mil width)
-  Minimize loop areas  in

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