Transient Blocking Units - TBU? Devices # Technical Documentation: C850180WH Ceramic Capacitor
Manufacturer : BOURNS
Document Version : 1.0
Last Updated : [Current Date]
## 1. Application Scenarios
### Typical Use Cases
The C850180WH is a multilayer ceramic capacitor (MLCC) primarily employed in:
- Power Supply Decoupling : Placed near IC power pins to suppress high-frequency noise
- RF Filtering : Used in π-filters and LC tank circuits for frequency selection
- Signal Coupling : AC coupling in audio and communication circuits
- Timing Circuits : RC oscillators and delay circuits requiring stable capacitance
- Bypass Applications : Shunting unwanted AC signals to ground in mixed-signal systems
### Industry Applications
- Consumer Electronics : Smartphones, tablets, and wearables for power management
- Automotive Electronics : Engine control units (ECUs), infotainment systems (meets AEC-Q200 requirements)
- Industrial Control : PLCs, motor drives, and power inverters
- Telecommunications : Base station equipment, network switches, and routers
- Medical Devices : Patient monitoring equipment and portable diagnostic tools
### Practical Advantages and Limitations
Advantages:
- Excellent high-frequency response with low ESR (<100mΩ typical)
- Non-polarized construction simplifies circuit design
- RoHS compliant and halogen-free composition
- Stable performance across temperature ranges (-55°C to +125°C)
- Compact 0805 case size (2.0×1.25mm) for high-density PCB layouts
Limitations:
- Limited capacitance value stability under DC bias conditions
- Moderate voltage coefficient (capacitance decreases with applied voltage)
- Susceptible to mechanical stress cracking if not properly mounted
- Lower capacitance density compared to some specialty dielectric formulations
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: DC Bias Derating
- Issue : Actual capacitance decreases significantly at rated voltage
- Solution : Select 50-100% higher nominal capacitance than calculated requirement
Pitfall 2: Mechanical Stress Failure
- Issue : Board flexure causing microcracks and catastrophic failure
- Solution :
- Orient capacitors parallel to board bending axis
- Maintain minimum 1mm clearance from board edges
- Use symmetric placement for balanced thermal stress
Pitfall 3: Acoustic Noise
- Issue : Piezoelectric effects causing audible noise in audio circuits
- Solution : Implement parallel combinations of different case sizes or use film capacitors in sensitive analog stages
### Compatibility Issues
With Active Components:
- Avoid direct connection to high-slew-rate op-amps without series resistance
- Compatible with most digital ICs (MCUs, FPGAs, memory devices)
With Passive Components:
- Excellent compatibility with resistors and inductors in filter networks
- May require derating when used with high-Q inductors in resonant circuits
Material Interactions:
- Incompatible with certain cleaning solvents that can penetrate dielectric
- Ensure compatibility with conformal coating materials
### PCB Layout Recommendations
Placement Strategy:
- Position decoupling capacitors within 2mm of IC power pins
- Use multiple vias for low-inductance connections to power planes
- Implement star-point grounding for analog and digital sections
Routing Guidelines:
- Keep trace lengths minimal (<5mm) for high-frequency decoupling
- Use 45° angles instead of 90° corners for reduced parasitic inductance
- Maintain consistent trace widths to avoid impedance discontinuities
Thermal Management:
- Avoid placement near heat-generating components (>5mm clearance)
- Provide adequate copper relief for soldering and thermal cycling
- Consider thermal vias for power applications
## 3. Technical Specifications
