4 /C 18 AWG Stranded Tinned Copper, FEP Insulation, Overall Aluminum/Polyester Shield, TC Braid Shield, and FEP Jacket # Technical Documentation: C8110 Ceramic Capacitor
Manufacturer : NEC
Component Type : Multilayer Ceramic Capacitor (MLCC)
Document Version : 1.0
Last Updated : [Current Date]
## 1. Application Scenarios
### Typical Use Cases
The C8110 ceramic capacitor serves as a high-frequency decoupling component in digital circuits, particularly in high-speed microprocessor and FPGA applications. Its primary function involves:
- Power supply filtering : Smoothing voltage ripples in DC power rails
- Signal coupling : AC coupling in RF and high-frequency analog circuits
- Bypass applications : Providing low-impedance paths for high-frequency noise
- Timing circuits : Used in oscillator and clock generation circuits where stable capacitance is critical
### Industry Applications
Consumer Electronics
- Smartphones and tablets for processor decoupling
- Television and display systems for signal integrity
- Wearable devices where space constraints demand compact components
Telecommunications
- Base station equipment for RF filtering
- Network switching equipment for power integrity
- 5G infrastructure components requiring stable high-frequency performance
Automotive Electronics
- Engine control units (ECUs) for noise suppression
- Infotainment systems requiring reliable operation across temperature ranges
- Advanced driver assistance systems (ADAS) where component reliability is critical
Industrial Applications
- Programmable logic controllers (PLCs)
- Motor drive circuits
- Power conversion systems
### Practical Advantages and Limitations
Advantages:
- High-frequency performance : Excellent ESL (Equivalent Series Inductance) characteristics up to 1GHz
- Temperature stability : X7R dielectric provides stable performance across -55°C to +125°C
- Compact footprint : 0805 package size enables high-density PCB designs
- Low ESR : Typically <100mΩ at 1MHz, ideal for power decoupling applications
- RoHS compliance : Meets environmental regulations for lead-free manufacturing
Limitations:
- Voltage derating : Capacitance decreases with applied DC bias voltage
- Microphonic effects : Susceptible to mechanical vibration in high-precision analog circuits
- Aging characteristics : X7R dielectric exhibits capacitance drift over time (approximately ±2.5% per decade hour)
- Limited capacitance values : Maximum 100nF in 0805 package size
- Board stress sensitivity : Mechanical stress from PCB bending can affect capacitance value
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Insufficient Decoupling
- Problem : Using single C8110 capacitor for entire power domain
- Solution : Implement multiple capacitors in parallel (e.g., 100nF, 10nF, 1nF) for broadband decoupling
Pitfall 2: Improper Placement
- Problem : Placing decoupling capacitors too far from IC power pins
- Solution : Position C8110 within 2mm of IC power pins to minimize parasitic inductance
Pitfall 3: Voltage Rating Oversight
- Problem : Operating near maximum rated voltage (50V)
- Solution : Derate to 70% of rated voltage (35V maximum operating voltage) for improved reliability
Pitfall 4: Thermal Management
- Problem : Ignoring self-heating effects in high-ripple current applications
- Solution : Calculate power dissipation (P = I² × ESR) and ensure adequate thermal relief
### Compatibility Issues with Other Components
Digital ICs
- Compatible with most CMOS and TTL logic families
- Ensure proper voltage rating matches IC supply voltage
- Watch for resonance issues when used with bulk capacitors
Analog Circuits
- May introduce piezoelectric noise in sensitive analog stages
- Consider film capacitors for high-precision
