BA8205FManufacturer: ROHM Tone Ringer | |||
| Partnumber | Manufacturer | Quantity | Availability |
|---|---|---|---|
| BA8205F | ROHM | 142 | In Stock |
Description and Introduction
Tone Ringer The BA8205F is a semiconductor device manufactured by ROHM. Below are the factual specifications from Ic-phoenix technical data files:
1. **Manufacturer**: ROHM   These specifications are based on available data for the BA8205F from ROHM. For precise details, always refer to the official datasheet. |
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Application Scenarios & Design Considerations
Tone Ringer # BA8205F Technical Documentation
## 1. Application Scenarios ### Typical Use Cases  Infrared Remote Control Systems   Home Appliance Control  ### Industry Applications  Industrial Control  ### Practical Advantages and Limitations  Advantages:   Limitations:  ## 2. Design Considerations ### Common Design Pitfalls and Solutions  Power Management Issues   Infrared Transmission Problems   LCD Display Artifacts  ### Compatibility Issues with Other Components  Infrared Receivers   LCD Panels   Power Supply Components  ### PCB Layout Recommendations  Power Distribution   Infrared Circuit Layout   Clock Circuit Considerations   General Layout |
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| Partnumber | Manufacturer | Quantity | Availability |
| BA8205F | ROHM | 150 | In Stock |
Description and Introduction
Tone Ringer The BA8205F is a remote control receiver IC manufactured by ROHM. It is designed for infrared remote control systems and supports multiple key inputs. Key specifications include:
- **Supply Voltage:** 2.5V to 5.5V   For detailed electrical characteristics and pin configurations, refer to the official ROHM datasheet. |
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Application Scenarios & Design Considerations
Tone Ringer # BA8205F Technical Documentation
## 1. Application Scenarios ### Typical Use Cases -  Consumer Electronics Remote Controls : Television sets, audio systems, air conditioners, and home entertainment systems ### Industry Applications  Industrial Applications : ### Practical Advantages and Limitations #### Advantages: #### Limitations: ## 2. Design Considerations ### Common Design Pitfalls and Solutions #### Power Management Issues #### Signal Integrity Problems #### Timing Inaccuracies ### Compatibility Issues with Other Components #### Infrared Receiver Compatibility #### Microcontroller Interface ### PCB Layout Recommendations #### Component Placement #### Routing Guidelines #### Thermal Considerations ## 3. Technical Specifications ### Key Parameter Explanations #### Electrical Characteristics |
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