WOUND CHIP POWER INDUCTOR # BRC2016T3R3M Technical Documentation
## 1. Application Scenarios
### Typical Use Cases
The BRC2016T3R3M serves as a high-frequency noise suppression component in various electronic circuits:
- Power Supply Filtering : Implements π-type or L-type filters in DC-DC converter input/output stages
- Signal Line Noise Absorption : Suppresses electromagnetic interference (EMI) in high-speed digital interfaces
- RF Circuit Matching : Provides impedance matching in RF front-end modules operating below 3GHz
- Oscillator Stabilization : Dampens harmonic oscillations in crystal oscillator circuits
### Industry Applications
Consumer Electronics
- Smartphones and tablets: Power management IC (PMIC) decoupling
- Wearable devices: Space-constrained noise filtering in compact designs
- IoT modules: RF interference suppression in wireless communication circuits
Automotive Electronics
- Infotainment systems: CAN bus noise filtering
- ADAS modules: Sensor signal integrity preservation
- Engine control units: Power line transient suppression
Telecommunications
- Base station equipment: RF power amplifier decoupling
- Network switches: High-speed data line EMI reduction
- 5G modules: Millimeter-wave circuit stabilization
### Practical Advantages and Limitations
Advantages:
- Ultra-compact 2016 (0603) package saves PCB real estate
- Low DC resistance (typically <100mΩ) minimizes voltage drop
- Wide frequency response (up to 3GHz) covers most modern applications
- Excellent high-frequency characteristics with minimal parasitic effects
- RoHS compliant and suitable for reflow soldering processes
Limitations:
- Limited current handling capacity (typically 2-3A maximum)
- Reduced effectiveness at very low frequencies (<10MHz)
- Sensitivity to mechanical stress due to ceramic construction
- Limited power dissipation capability in high-current applications
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Inadequate Current Rating
- Problem : Exceeding maximum current causes thermal degradation
- Solution : Implement parallel beads for high-current paths or select higher-current rated components
Pitfall 2: DC Bias Effect
- Problem : Inductance decreases significantly under DC bias conditions
- Solution : Characterize performance at expected operating currents and derate accordingly
Pitfall 3: Resonance Issues
- Problem : Parallel resonance can occur at specific frequencies
- Solution : Use simulation tools to identify resonance points and implement damping networks
### Compatibility Issues with Other Components
Capacitor Interactions
- Avoid creating unintended LC tanks with decoupling capacitors
- Maintain proper separation from high-Q components to prevent oscillation
Active Device Considerations
- Ensure compatibility with high-speed ICs (FPGAs, processors)
- Verify no impact on signal integrity in high-speed digital interfaces
Power Supply Compatibility
- Check for compatibility with switching regulator frequencies
- Ensure no adverse effects on power supply stability
### PCB Layout Recommendations
Placement Strategy
- Position as close as possible to noise sources
- Maintain minimum distance from heat-generating components
- Ensure adequate clearance for automated optical inspection (AOI)
Routing Guidelines
- Use wide traces for high-current applications to minimize resistance
- Implement ground planes for optimal high-frequency performance
- Avoid sharp bends in signal lines adjacent to the bead
Thermal Management
- Provide sufficient copper area for heat dissipation
- Consider thermal vias for improved heat transfer in high-power applications
- Monitor temperature rise during operation, especially in enclosed spaces
## 3. Technical Specifications
### Key Parameter Explanations
Impedance Characteristics
- Nominal Impedance : 3.3Ω ±25% at 100MHz
- Frequency Response : Effective range from 10MHz to 3GHz
- DC Resistance : Maximum
