UNSHR.HEADER DR SMT # Technical Documentation: 95278101A16LF Connector
Manufacturer : FCI
## 1. Application Scenarios
### Typical Use Cases
The 95278101A16LF is a high-density board-to-board connector system designed for applications requiring reliable interconnections in space-constrained environments. Typical implementations include:
- Backplane Interconnections : Provides robust connections between daughter cards and main system backplanes
- Module-to-Motherboard Interfaces : Enables secure attachment of functional modules to primary PCBs
- High-Speed Data Transmission : Supports signal integrity in data communication pathways
- Power Distribution Systems : Facilitates reliable power delivery between system components
### Industry Applications
- Telecommunications Equipment : Base station modules, network switches, and routing equipment
- Industrial Automation : PLC systems, motor controllers, and sensor interface modules
- Medical Devices : Patient monitoring systems, diagnostic equipment, and imaging systems
- Automotive Electronics : Infotainment systems, control modules, and advanced driver assistance systems (ADAS)
- Consumer Electronics : High-end gaming consoles, smart home devices, and premium audio equipment
### Practical Advantages and Limitations
Advantages:
- High Density : Enables significant space savings compared to conventional connectors
- Reliable Mating : Precision alignment features ensure consistent connection integrity
- Robust Construction : Withstands mechanical stress and vibration in demanding environments
- Versatile Configuration : Multiple contact arrangements available for various application needs
- Industry Compliance : Meets relevant industry standards for safety and performance
Limitations:
- Precision Requirements : Demands accurate PCB fabrication and assembly processes
- Cost Considerations : Higher per-position cost compared to standard pitch connectors
- Insertion Force : May require specialized tooling for high-pin-count applications
- Cleaning Challenges : Complex geometries can complicate post-assembly cleaning processes
## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Mechanical Stress Concentration
- Issue : Inadequate strain relief causing solder joint fatigue
- Solution : Implement proper board stiffeners and mechanical support features
- Implementation : Use mounting ears and additional fastening points near connector
Pitfall 2: Signal Integrity Degradation
- Issue : Crosstalk and impedance mismatches in high-speed applications
- Solution : Careful routing with controlled impedance and proper grounding
- Implementation : Maintain consistent trace widths and implement ground planes
Pitfall 3: Thermal Management
- Issue : Inadequate heat dissipation affecting connector performance
- Solution : Ensure proper airflow and thermal relief in PCB design
- Implementation : Use thermal vias and consider heat sinking requirements
### Compatibility Issues
Mating Connector Requirements:
- Requires precisely matched counterpart connectors from the same series
- Verify mechanical keying compatibility to prevent mis-mating
Component Clearance:
- Maintain minimum 3mm clearance from tall components
- Ensure adequate space for mating/unmating operations
- Consider tool access requirements for installation and removal
Material Compatibility:
- Verify plating compatibility with mating surfaces
- Ensure thermal expansion coefficients match application requirements
- Check chemical compatibility with cleaning agents and operating environments
### PCB Layout Recommendations
Placement Guidelines:
- Position connectors to allow straight insertion/extraction paths
- Maintain minimum board edge clearance of 5mm
- Consider service access requirements for field maintenance
Routing Considerations:
- Signal Integrity : Route critical signals on inner layers with reference planes
- Power Distribution : Use multiple vias for power connections to reduce inductance
- Grounding : Implement continuous ground planes beneath connector area
Thermal Management:
- Use thermal relief patterns in power pads
- Implement adequate copper pour for heat dissipation
- Consider thermal vias for high-current applications
Manufacturing Considerations:
