87705-0021Manufacturer: MOLEX 1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 2.67mm (.105") Tail Length, Beige Latches | |||
| Partnumber | Manufacturer | Quantity | Availability |
|---|---|---|---|
| 87705-0021,877050021 | MOLEX | 40 | In Stock |
Description and Introduction
1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 2.67mm (.105") Tail Length, Beige Latches The part number 87705-0021 is manufactured by MOLEX. It is a connector part, specifically a 2.00mm pitch, 2-position, vertical, through-hole, wire-to-board connector. The connector is designed for use in various electronic applications, providing a reliable connection between wires and a printed circuit board (PCB). The housing material is typically made of high-temperature, flame-retardant thermoplastic, and the contacts are usually made of phosphor bronze with a tin or gold plating for enhanced conductivity and corrosion resistance. The connector is rated for a current of up to 3.0A and a voltage of up to 250V AC/DC. It is designed to accommodate wire sizes ranging from 28 AWG to 22 AWG. The operating temperature range is generally from -40°C to +105°C. The connector is compliant with RoHS (Restriction of Hazardous Substances) standards, ensuring it is free from certain hazardous materials.
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Application Scenarios & Design Considerations
1.00mm (.039") Pitch DDR-II DIMM Socket, Vertical, Center Keys, 2.67mm (.105") Tail Length, Beige Latches # Technical Documentation: MOLEX 877050021 Connector System
## 1. Application Scenarios ### Typical Use Cases -  Industrial Automation : Deployed in PLCs (Programmable Logic Controllers), motor drives, and sensor interfaces where vibration resistance and secure connections are critical ### Industry Applications ### Practical Advantages ### Limitations ## 2. Design Considerations ### Common Design Pitfalls and Solutions  Pitfall 1: Insufficient Strain Relief   Pitfall 2: Improper Polarization   Pitfall 3: Thermal Mismatch  ### Compatibility Issues  Electrical Compatibility   Mechanical Compatibility   Environmental Compatibility  ### PCB Layout Recommendations  Footprint Design   Routing Considerations   Assembly Guidelines  |
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