Diode and tyristor module# Technical Documentation: 4R3TI20Y080
Manufacturer : FUJI
Component Type : High-Frequency Inductor
Series : 4R3TI Series
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## 1. Application Scenarios
### Typical Use Cases
The 4R3TI20Y080 is a surface-mount power inductor designed for high-frequency power conversion applications. Its primary use cases include:
- DC-DC Converters : Buck, boost, and buck-boost configurations in switching frequencies from 500kHz to 3MHz
- Voltage Regulation Modules (VRMs) : Providing stable power delivery to processors and ASICs
- Power Supply Filtering : Noise suppression in switching power supplies
- Load Point Converters : Distributed power architecture implementations
### Industry Applications
- Telecommunications : Base station power systems, network equipment power management
- Automotive Electronics : ADAS power supplies, infotainment systems, engine control units
- Industrial Automation : Motor drives, PLC power circuits, industrial computing
- Consumer Electronics : Smartphones, tablets, gaming consoles, IoT devices
- Medical Equipment : Portable medical devices, diagnostic equipment power systems
### Practical Advantages
- High Saturation Current : 20A rating enables handling of high transient loads
- Low DC Resistance : 0.8mΩ typical minimizes power losses
- Excellent Thermal Performance : Maintains stability up to 125°C ambient temperature
- Shielded Construction : Reduces electromagnetic interference (EMI)
- Compact Footprint : 4.3mm × 3.2mm package saves board space
### Limitations
- Frequency Limitations : Performance degrades above 3MHz switching frequency
- Current Handling : Not suitable for applications exceeding 20A peak current
- Temperature Constraints : Derating required above 105°C operating temperature
- Mechanical Stress : Vulnerable to board flexure and vibration without proper mounting
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## 2. Design Considerations
### Common Design Pitfalls and Solutions
Pitfall 1: Inadequate Current Headroom
- Problem : Operating near saturation current causes inductance drop
- Solution : Design with 20-30% margin below Isat rating
Pitfall 2: Thermal Management Issues
- Problem : Excessive temperature rise reduces efficiency and lifespan
- Solution : Implement proper thermal vias and copper pours
Pitfall 3: EMI Radiation
- Problem : Unshielded magnetic field interferes with sensitive circuits
- Solution : Use the built-in shielding and maintain minimum clearance
### Compatibility Issues
With Switching ICs :
- Ensure controller switching frequency matches inductor's optimal range (500kHz-2MHz)
- Verify driver capability to handle inductor's parasitic capacitance
With Capacitors :
- Input/output capacitors must have low ESR to complement inductor performance
- Consider resonant frequency matching with ceramic capacitors
With Other Magnetic Components :
- Maintain minimum 5mm separation from transformers
- Avoid parallel orientation with other inductors to prevent coupling
### PCB Layout Recommendations
Placement :
- Position close to switching IC (within 10mm maximum)
- Orient to minimize loop area in power path
- Avoid placement near board edges
Routing :
- Use wide, short traces for high-current paths
- Maintain continuous ground plane beneath inductor
- Keep sensitive analog traces at least 5mm away
Thermal Management :
- Implement 4-6 thermal vias in pad connection
- Use 2oz copper for power planes
- Provide adequate copper area for heat dissipation
EMI Considerations :
- Surround with ground guard rings
- Use stitching vias around the component
- Consider additional shielding for sensitive applications
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## 3. Technical Specifications
### Key Parameter Explanations
Inductance (L)
