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VSP5010 from BB/TI, 296pcs , QFP64,12-bit, 30 MSPS 2-Channel AFE for CCD/CMOS/CIS Sensors 64-LQFP -25 to 85
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VSP5010 BB/TI N/a 296
VSP5010 from TI, Texas Instruments 41pcs , TQFP64,12-bit, 30 MSPS 2-Channel AFE for CCD/CMOS/CIS Sensors 64-LQFP -25 to 85
features• High-Speed Operation: correlated double sampling (CDS) andsample-and-hold (S/H) processing stages, 14– Sample Rate: 31 MHz (max, Designanalog-to-digital converter (ADC) blocks, a digitalEnsured)programmable gain amplifier (DPGA), and an optical– 78-dB SNR (at 0-dB Gain)black (OB) correction loop. Data are output in a 12-bit• Low-Power Consumption: word; two-channel ADC data are multiplexed andthen output.– Low Voltage: 3.0 V to 3.6 VThe VSP5010 operates from a single 3.3-V supply.– Low Power: 290 mW (typ at 3.3 V)The device is available in an LQFP-64 package.– Standby Mode: 20 mW (typ)1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.2All trademarks are the property of their respective owners.PRODUCT PREVIEW information concerns products in theCopyright 2008, Texas Instruments Incorporatedformative or design phase of development. Characteristic data andother specifications are design goals. Texas Instruments reservesthe right to change or discontinue these products without notice.PRODUCT PREVIEWPACKAGE OPTION ADDENDUM/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 1PACKAGE OPTION ADDENDUM
VSP5010PMR BB/TI,15-Apr-2017PACKAGING INFORMATIONOrderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device ..

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