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V23809-C8-C10 |V23809C8C10SIEMENSN/a2avaiMM 170 MBd FE/FDDI/ATM Transceiver


V23809-C8-C10 ,MM 170 MBd FE/FDDI/ATM TransceiverFEATURESSupply Voltage (V –V )... –0.5 V to 7 VCC EE• Compliant with Fast Ethernet, FDDI, Fibre Cha ..
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V23809-C8-C10
MM 170 MBd FE/FDDI/ATM Transceiver
11 dB V23809-C8-C10Multimode 1300 nm LED Fast Ethernet/FDDI/ATM
170 MBd 1x9 Transceiver
FEATURESCompliant with Fast Ethernet, FDDI, Fibre Channel,
ATM/SONET/SDH standardsCompact integrated transceiver unit with duplex SC
receptacleSingle power supply with 3.0 V to 5.5 V range Extremely low power consumption < 0.7 W at 3.3 VPECL differential inputs andoutputsSystem optimized for 62.5/50 μm graded indexfiberIndustry standard multisource footprintVery low profile for high slot densityWave solderable and washable with process
pluginsertedestboard availableUL-94 V-0 certifiedESD Class 1 per MIL-STD 883D Method 3015.7 (March 89)Compliant with FCC (Class B) and EN 55022For distances of up to 2 km on multimode fiber
APPLICATIONSATM switches/bridges/routersFast Ethernet, FDDIHigh speed computer linksLocal area networksSwitching systems
Absolute Maximum Ratings

Exceeding any one of these values may destroy the device
immediately.
Supply Voltage (VCC–VEE).......................................–0.5 V to 7 V
Data Input Levels (PECL) (VIN)..................................... VEE–VCC
Differential Data Input Voltage...............................................3 V
Operating Ambient Temperature (TAMB)............0°C to 85°C
Storage Ambient Temperature............................–40°C to 85°C
Soldering Conditions, Temp/Time (TSOLD/tSOLD)
(MIL-STD 883C, Method 2003)..............................270°C/10s
ESD Resistance (all pins to VEE, human body)..................1.5 kV
Output Current (IO)...........................................................50 mA
*Available also as 8 dB V23809-C8-C11 on request.
DESCRIPTION
This data sheet describes the Infineon Fast Ethernet/FDDI/ATM
transceiver—part of Infineon Multistandard Transceiver Family.
It is fully compliant with the Asynchronous Transfer Mode
(ATM) OC-3 standard, the Fiber Distributed Data Interface
(FDDI) Low Cost Fiber Physical Layer Medium Dependent (LCF-
PMD) draft standard(1), and the FDDI PMD standard(2).
ATM was developed because of the need for multimedia appli-
cations, including real time transmission. The data rate is scal-
able and the ATM protocol is the basis of the broadband public
networks being standardized in the International Telegraph and
Telephone Consultative Committee (CCITT). ATM can also be
used in local private applications.
FDDI is a Dual Token Ring standard developed in the U.S. by the
Accredited National Standards Committee (ANSC) X3T9, within
the Technical Committee X3T9.5. It is applied to the local area
networks of stations, transferring data at 100 Mbits/s with a
125MBaud transmission rate. LCF FDDI is specially developed
for short distance applications of up to 500m (fiber-to-the-desk)
as compared to 2 km for backbone applications.
Fast Ethernet was developed because of the higher bandwidth
requirement in local area networking. It is based on the proven
effectiveness of millions of installed Ethernet systems.
The Infineon multimode transceiver is a single unit comprised
of a transmitter, a receiver, and an SC receptacle. This design
frees the customer from many alignment and PC board layout
concerns. The modules are designed for low cost applications.
The inputs/outputs are PECL compatible and the unit operates
from a 3.0 V to 5.5 V power supply. As an option, the data out-
put stages can be switched to static levels during absence of
light, as indicated by the Signal Detect function. It can be
directly interfaced with available chipsets.
Notes. FDDI Token Ring, Low Cost Fiber Physical Layer Medium Depen-
dent (LCF-PMD) ANSI X3T9.5 / 92 LCF-PMD / Proposed Rev. 1.3,
September 1, 1992. American National Standard.
2. FDDI Token Ring, Physical Layer Medium Dependent (PMD) ANSI
X3.166-1990 American National Standard. ISO/IEC 9314-3: 1990.
Regulatory Compliance
TECHNICAL DATA

The electro-optical characteristics described in the following
tables are valid only for use under the recommended operating
conditions.
Recommended Operating Conditions

Notes
1. For VCC–VEE (min., max.). 50% duty cycle. The supply current CC2+ICC3) does not include the load drive current (Icc1). Add max.
45 mA for the three outputs. Load is 50 Ω into VCC –2V.
2. To maintain good LED reliability, the device should not be held in the
ON state for more than the specified time. Normal operation should
be done with 50% duty cycle.
3. To achieve proper PECL output levels the 50 Ω termination should be
done to VCC –2 V. For correct termination see the application notes.
ransmitter Electro-Optical CharacteristicsNotes.Measured at the end of 5 meters of 62.5/125/0.275 graded index
fiber using calibrated power meter and a precision test ferrule.
Cladding modes are removed. Values valid for EOL and worst-case
temperature.The input data pattern is a 12.5 MHz square wave pattern.Center wavelength is defined as the midpoint between the two
50% levels of the optical spectrum of the LED.Spectral width (full width, half max) is defined as the difference
between 50% levels of the optical spectrum of the LED.10% to 90% levels. Measured using the 12.5 MHz square wave
pattern with an optoelectronic measurement system (detector
andoscilloscope) having 3 dB bandwidth ranging from less than
0.1MHz to more than 750 MHz.Extinction Ratio is defined as PL/PH x 100%. Measurement system
as in Note 5..Optical Power Low is the output power level when a steady state
low data pattern (FDDI Quiet Line state) is used to drive the trans-
mitter. Value valid <1 ms after input low.Test method as for FDDI-PMD. Jitter values are peak-to-peak. Duty Cycle Distortion is defined as 0.5 [(width of wider state) minus
(width of narrower state)]. It is measured with stream of Idle
Symbols (62.5MHz square wave).
10.Measured with the same pattern as for FDDI-PMD.
11.Measured with the Halt Line state (12.5 MHz square wave).
Receiver Electro-Optical Characteristics

NotesPattern: Manchester coding / NRZI (no scrambling)
2. For a bit error rate (BER) of less than 1x10E–12 over a receiver eye
opening of least 1.5 ns. Measured with a 223–1 PRBS at 155 MBd.
3. For a BER of less than 1x10E-12. Measured in the center of the eye
opening with a 223-1 PRBS at 155 MBd.
4. Measured at an average optical power level of –20 dBm with a 62.5
MHz square wave.
5. All jitter values are peak-to-peak. RX output jitter requirements are
not considered in the ATM standard draft. In general the same
requirements as for FDDI are met.
6. Measured at an average optical power level of –20 dBm. . Measured at –33 dBm average power.
8. An increase in optical power through the specified level will
causethe SIGNAL detect output to switch from a Low state to High state.
9. A decrease in optical power through the specified level will
causethe SIGNAL detect output to switch from a High state to
aLow state.
10. PECL compatible. Load is 50 Ω into VCC –2 V. Measured under DC
conditions. For dynamic measurements a tolerance of 50 mV should
be added for VCC=5 V.
Pin Description
APPLICATION NOTE
Multimode 1300 nm ATM 1x9 Transceiver

The power supply filtering is required for good EMI perfor-
mance. Use short tracks from the inductor L1/L2 to the module CC–RX/VCC–TX.
A GND plane under the module is recommended for good EMI
and sensitivity performance.
APPLICATION NOTE FOR MULTIMODE 1300 NM LED TRANSCEIVER
Solutions for connecting a Infineon 3.3 V Fiber Optic Transceiver to a 5.0 V Framer-/Phy-Device.
Figure 1. Common GND
Figure 2. Common VCC
Published by Infineon Technologies AG
© Infineon Technologies AG 1999
All Rights Reserved
Attention please!

The information herein is given to describe certain components and shall not be
considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties
of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information

For further information on technology, delivery terms and conditions and prices
please contact the Infineon Technologies offices or our Infineon Technologies
Representatives worldwide - see our webpage at
www.infineon.com/fiberoptics
Warnings

Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your Infineon Technologies
offices.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the
human body, or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons
may be endangered.
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