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TLV2772IDRG4 from TI, Texas Instruments 2530pcs , SOIC-8,Dual 2.7-V High Slew Rate Rail-To-Rail Output Operational Amplifier 8-SOIC -40 to 125
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TLV2772IDRG4 TI N/a 2530
WWW.TI.COM                SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004TLV2770 and TLV2771 AVAILABLE OPTIONSPACKAGED DEVICESV V max A max AT T 25 25° °C CIO IOTSMALL OUTLINE SOT-23 MSOP PLASTIC DIPA(mV)(D) (DBV) (DGK) (P)†TLV2770CD — TLV2770CDGK TLV2770CP0°C to 70°C 2.5TLV2771CD TLV2771CDBV — —†TLV2770ID — TLV2770IDGK TLV2770IP2.5TLV2771ID TLV2771IDBV — —−40 −40° °C to 125 C to 125° °C CTLV2770AID — — TLV2770AIP1.6TLV2771AID — — —†This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.TLV2772 and TLV2773 AVAILABLE OPTIONSPACKAGED DEVICESV V max A max AT T 25 25° °C CIO IOTSMALL OUTLINE MSOP MSOP PLASTIC DIP PLASTIC DIPA(mV)(D) (DGK) (DGS) (N) (P)TLV2772CD TLV2772CDGK — — TLV2772CP0°C to 70°C 2.5TLV2773CD — TLV2773CDGS TLV2773CN —TLV2772ID TLV2772IDGK — — TLV2772IP2.5TLV2773ID — TLV2773IDGS TLV2773IN —−40 −40° °C to 125 C to 125° °C CTLV2772AID — — — TLV2772AIP1.6TLV2773AID — — TLV2773AIN —TLV2774 and TLV2775 AVAILABLE OPTIONSPACKAGED DEVICESV V max A max AT T 25 25° °C CIO IOTSMALL OUTLINE PLASTIC DIP PLASTIC DIP TSSOPA(mV)(D) (N) (P) (PW)TLV2774CD — TLV2774CP TLV2774CPW0°C to 70°C 2.7TLV2775CD TLV2775CN — TLV2775CPWTLV2774ID — TLV2774IP TLV2774IPW2.7TLV2775ID TLV2775IN — TLV2775IPW−40 −40° °C to 125 C to 125° °C CTLV2774AID — TLV2774AIP TLV2774AIPW2.1TLV2775AID TLV2775AIN — TLV2775AIPWTLV2772M/Q AND TLV2772AM/Q AVAILABLE OPTIONSPACKAGED DEVICESV max AT 25°CSMALL CERAMICIOTCHIP CARRIER CERAMIC DIP TSSOPA(mV)OUTLINE FLATPACK(FK) (JG) (PW)(D) (U)‡ ‡2.5 TLV2772QD — — — TLV2772QPW−40 −40° °C to 125 C to 125° °C C‡ ‡1.6 TLV2772AQD — — — TLV2772AQPW2.5 TLV2772MD TLV2772MFK TLV2772MJG TLV2772MU —−55 −55° °C to 125 C to 125° °C C1.6 TLV2772AMD TLV2772AMFK TLV2772AMJG TLV2772AMU —‡Available in tape and reel2

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