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TLC3702MDREPTIN/a4266avaiDual, Micropower, Push-Pull Outputs, LinCMOS(TM) Voltage Comparator


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TLC3702MDREP
Dual, Micropower, Push-Pull Outputs, LinCMOS(TM) Voltage Comparator
Enhanced Diminishing ManufacturingSources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Push-Pull CMOS Output Drives Capacitive
Loads Without Pullup Resistor,O = ± 8 mA
Very Low Power... 100 µW Typ at 5 V Fast Response Time ...t PLH = 2.7 µs Typ
With 5-mV Overdrive
Single-Supply Operation ...4 V to 16 V On-Chip ESD Protection
†Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.

description

The TLC3702 consists of two independent micropower voltage comparators designed to operate from a single
supply and be compatible with modern HCMOS logic systems. They are functionally similar to the LM339 but
use one-twentieth of the power for similar response times. The push-pull CMOS output stage drives capacitive
loads directly without a power-consuming pullup resistor to achieve the stated response time. Eliminating the
pullup resistor not only reduces power dissipation, but also saves board space and component cost. The output
stage is also fully compatible with TTL requirements.
Texas Instruments LinCMOS process offers superior analog performance to standard CMOS processes.
Along with the standard CMOS advantages of low power without sacrificing speed, high input impedance, and
low bias currents, the LinCMOS process offers extremely stable input offset voltages with large differential
input voltages. This characteristic makes it possible to build reliable CMOS comparators.
ORDERING INFORMATION
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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