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T835-600
HIGH PERFORMANCE TRIAC
T835-600G
T850-600GMay 1998 - Ed: 3A
HIGH PERFORMANCE TRIAC
ABSOLUTE RATINGS (limiting values)HIGH COMMUTATION PREFORMANCES
SNUBBERLESSTM TECHNOLOGY
HIGH NOISE IMMUNITY (dV/dt)
HIGH ITSM
FEATURESThe T835-600G and T850-600G triacs are using
high performance SNUBBERLESS technology.
They are intended for AC control applications
using surface mount tecnology.
These devices are perfectly suited where high
commutation and surge performances are
required.
DESCRIPTION1/5
PG (AV)= 1 W PGM = 10 W (tp = 20 μs) IGM = 4 A (tp = 20 μs)
GATE CHARACTERISTICS (maximum values)
THERMAL RESISTANCES* For either polarity of electrode A2 voltage with reference to electrode A1.
ELECTRICAL CHARACTERISTICS
ORDERING INFORMATIONAdd "-TR" suffix for Tape & Reel shipment
T835-600G / T850-600G2/5
P(W)
Fig. 1: Maximum power dissipation versus RMS
on-state current. 25 50 75 100 1250
(A)T(RMS)
Fig. 3: RMS on-state current versus case tem-perature.
-40 -20 0 20 40 60 80 100 120 1400.0
2.5
,I [Tj]/I,I [Tj=25°C]GTH GTH
Fig. 5: Relative variation of gate trigger current andholding current versus junction temperature (typi-
cal values). 20 40 60 80 100 120 1400
P(W) Tcase (°C)
Fig. 2: Correlation between maximum power dissi-pation and maximum allowable temperatures
(Tamb and Tcase) for different thermal resistances
heatsink+contact.
1E-30.01
K=[Zth/Rth]
Fig. 4 : Relative variation of thermal impedance
versus pulse duration. 0
ITSM(A)
Fig. 6: Non repetitive surge peak on-state currentversus number of cycles.
T835-600G / T850-600G3/5
5 1010ITSM(A),I²t(A²s)
Fig. 7: Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I2t. 4 8 12162024 2832 36400
Rth(j-a) (°C/W)
Fig. 9: Thermal resistance junction to ambient ver-sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35μm).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.01
100
(A)TM
Fig. 8: On-state characteristics (maximum values). 40 80 120 160 200 240 280 320 360
T (°C)Fig. 10: Typical reflow soldering heat profile, either
for mounting on FR4 or metal-backed boards.
T835-600G / T850-600G4/5
PACKAGE MECHANICAL DATA2 PAK
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
FOOT PRINT DIMENSIONS (in millimeters)
MARKING
PACKINGTube : 50 units
Tape and reel : 500 units
T835-600G / T850-600G5/5
This datasheet has been :
www.ic-phoenix.com
Datasheets for electronic components.
