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MMFT2406T1ONN/a12440avaiMEDIUM POWER TMOS FET 700 mA 240 VOLTS
MMFT2406T1GONN/a32500avaiPower MOSFET 700 mA, 240 Volts


MMFT2406T1G ,Power MOSFET 700 mA, 240 VoltsELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristics Symbol Min Max UnitOFF ..
MMFT2406T3 ,Power MOSFETMaximum ratings applied to the device are individual stress limit values (not1 2 3normal operating ..
MMFT2955E ,TMOS MEDIUM POWER FET 1.2 AMP 60 VOLTS3R , DRAIN-TO-SOURCE RESISTANCE (OHMS)I , DRAIN CURRENT (AMPS) I , DRAIN CURRENT (AMPS)DS(on)D DR , ..
MMFT2955ET1G ,Power MOSFET 1 Amp, 60 VoltsELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristic Symbol Min Typ Max Unit ..
MMFT3055EL ,MEDIUM POWER LOGIC LEVEL TMOS FET 1.5 AMP 60 VOLTS**Order this documentSEMICONDUCTOR TECHNICAL DATA by MMFT3055EL/D ** ** * ** **N–Channel Enhancemen ..
MMFT3055V ,TMOS POWER FET 1.7 AMPERES 60 VOLTS3, DRAIN−TO−SOURCE RESISTANCE , DRAIN−TO−SOURCE RESISTANCE (OHMS) I , DRAIN CURRENT (AMPS)R RDS(on) ..
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MMFT2406T1-MMFT2406T1G
Power MOSFET 700 mA, 240 Volts
MMFT2406T1
Power MOSFET
700 mA, 240 V, N−Channel, SOT−223

This Power MOSFET is designed for high speed, low loss power
switching applications such as switching regulators, converters,
solenoid and relay drivers. The device is housed in the SOT−223
package which is designed for medium power surface mount
applications. Silicon Gate for Fast Switching Speeds High Voltage − 240 Vdc Low Drive Requirement The SOT−223 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering,
eliminating the possibility of damage to the die. Pb−Free Packages are Available
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
THERMAL CHARACTERISTICS

Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected. Device mounted on a glass epoxy printed circuit board 1.575 in x 1.575 in
x 0.059 in; mounting pad for the collector lead min. 0.93 sq in.
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