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MAX1740EUB-MAX1741EUB
SIM/Smart Card Level Translators in レMAX
General DescriptionThe MAX1740/MAX1741 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirec-
tional level shifters for the reset and clock signals, a bidi-
rectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.
The MAX1740 includes a SHDNcontrol input to aid
insertion and removal of SIM and smart cards, while the
MAX1741 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.425V to +5.5V for the “con-
troller side” and +2.25V to +5.5V for the “card side.”
Total supply current is 2.5µA max. Both devices automat-
ically shut down when either power supply is removed.
For a complete SIM-card interface, combine the
MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regu-
lated charge pump.
The MAX1740/MAX1741 are available in ultra-small 10-
pin µMAX packages that are only 1.09mm high and half
the area of an 8-pin SO.
The MAX1740/MAX1741 are compliant with GSM test
specifications 11.11 and 11.12.
ApplicationsSIM Interface in GSM Cellular Telephones
Smart Card Readers
Logic Level Translation
SPI™/QSPI™/MICROWIRE™ Level Translation
FeaturesSIM/Smart Card Level Shifting±10kV ESD Card Socket ProtectionAllows Level Translation with DVCC≥
VCC or
DVCC ≤VCCAutomatically Shuts Down When Either Supply Is
RemovedCard Contacts Actively Pulled Low During
Shutdown+1.425V to +5.5V Controller Voltage Range+2.25V to +5.5V Card Voltage Range2.5µA (max) Total Quiescent Supply Current0.01µA Total Shutdown Supply CurrentUltra-Small 10-Pin µMAX PackageCompliant with GSM Test Specifications 11.11
and 11.12
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
Typical Operating Circuit19-1458; Rev 0; 1/00
Pin Configuration
Ordering InformationSPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN= DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO= CCLK= CRST= CDATA= 30pF, TA
= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DVCC, VCCto GND................................................-0.3V to +6.0V
RIN, CIN, DATA, DDRV,
SHDNto GND......................................-0.3V to (DVCC + 0.3V)
RST, CLK, IO to GND ................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range ............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) ................................+300°C
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ELECTRICAL CHARACTERISTICS (continued)(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN= DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO= CCLK= CRST= CDATA= 30pF, TA
= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ELECTRICAL CHARACTERISTICS(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN= DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO= CCLK= CRST= CDATA= 30pF, TA
= -40°C to +85°C, unless otherwise noted.) (Note 5)
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ELECTRICAL CHARACTERISTICS (continued)
(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN= DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO= CCLK= CRST= CDATA= 30pF, TA= -40°C to +85°C, unless otherwise noted.) (Note 5)
Note 1:VILis defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.
Note 2:VIHis defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.
Note 3:Timing specifications are guaranteed by design, not production tested.
Note 4:The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is
applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform.
Note 5:Specifications to -40°C are guaranteed by design, not production tested.
Typical Operating Characteristics
(Circuit of Figure 1, DVCC= 3.0V, VCC= 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
Typical Operating Characteristics (continued)
(Circuit of Figure 1, DVCC= 3.0V, VCC= 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)
