MAX1567ETL ,PLASTIC ENCAPSULATED DEVICESTable of Contents I. ........Device Description V. ........Quality Assurance Information II ..
MAX1567ETL+ ,Six-Channel, High-Efficiency, Digital Camera Power SuppliesMAX1566/MAX156719-2882; Rev 1; 4/04Six-Channel, High-Efficiency, DigitalCamera Power Supplies
MAX1567ETL+T ,Six-Channel, High-Efficiency, Digital Camera Power SuppliesFeaturesThe MAX1566/MAX1567 provide a complete power-♦ 95% Efficient Step-Up DC-to-DC Convertersupp ..
MAX156ACWI ,8-/4-Channel ADCs with Simultaneous T/Hs and Reference19-2949; Rev 1; 6/94
lVI/JXI/I/I
8-/4-Channel ADCs with
Simultaneous T/Hs and Reference
MAX156AENG ,8-/4-Channel ADCs with Simultaneous T/Hs and ReferenceELECTRICAL CHARACTERISTICS
(VDD = +5V, REFIN = +2.5V, External Reference, AGND = DGND = 0V, Vss ..
MAX156AEWI+ ,High-Speed, 8-Channel, 8-Bit ADC with Simultaneous Track/Holds and ReferenceFeaturesThe MAX155/MAX156 are high-speed, 8-bit, multichan- ● 8 Simultaneously Sampling Track/Hold ..
MAX4232AKA+ ,High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70MAX4230–MAX4234 High-Output-Drive, 10MHz, 10V/μs, Rail-to-Rail I/O Op Amps with Shutdown in SC70
MAX4232AKA+T ,High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70Electrical Characteristics(V = 2.7V, V = 0V, V = V , V = (V ), R = ∞ connected to (V ), V = V , T = ..
MAX4232AKA-T ,High-output-drive, 10 MHz, 10V/us, rail-to-rail I/O op amps with shutdown in SC70ApplicationsMAX4231AUT-T -40°C to +125°C 6 SOT23-6 AAUVPortable Headphone Speaker Drivers (32Ω )Ord ..
MAX4232AUA+ ,High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70Electrical Characteristics (continued)(V = 2.7V, V = 0V, V = V , V = (V ), R = ∞ connected to (V ), ..
MAX4232AUA+ ,High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70ApplicationsMAX4230AUK+T -40°C to +125°C 5 SOT23 ABZZ● RF PA Biasing Controls in Handset
MAX4232AUA+T ,High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70Electrical Characteristics (continued)(V = 2.7V, V = 0V, V = V , V = (V ), R = ∞ connected to (V ), ..
MAX1567ETL
PLASTIC ENCAPSULATED DEVICES
MAX1567ETL Rev. A RELIABILITY REPORT
FOR
MAX1567ETL PLASTIC ENCAPSULATED DEVICES
November 13, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by Reviewed by
Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director
Conclusion The MAX1567 sucessfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information ......Attachments
I. Device Description
A. General
The MAX1567 provides a complete power-supply solution for digital cameras. It improves performance, component
count, and size compared to conventional multichannel controllers in 2-cell AA, 1-cell lithium-ion (Li+), and dual-
battery designs. On-chip MOSFETs provide up to 95% efficiency for critical power supplies, while additional
channels operate with external FETs for optimum design flexibility. This optimizes overall efficiency and cost, while
also reducing board space.
The MAX1567 includes six high-efficiency DC-to-DC conversion channels:
· Step-up DC-to-DC converter with on-chip power FETs
· Main DC-to-DC converter with on-chip FETs, configurable to step either up or down
· Step-down core DC-to-DC converter with on-chip FETs
· DC-to-DC controller for white LEDs or other output
· Transformerless inverting DC-to-DC controller (typically for negative CCD bias)
All DC-to-DC channels operate at one fixed frequency settable from 100kHz to 1MHz to optimize size, cost, and
efficiency. Other features include soft-start, power-OK outputs, and overload protection. The MAX1567 is available in
space-saving 40-pin thin QFN packages. An evaluation kit is available to expedite designs. B. Absolute Maximum Ratings Item Rating PV, PVSU, SDOK, AUX1OK, SCF, ON_, FB_, SUSD to GND -0.3V to +6V
PG_ to GND -0.3V to +0.3V
DL1, DL3, INDL2, PVM, PVSD to GND -0.3V to (PVSU + 0.3V)
DL2 to GND -0.3V to (INDL2 + 0.3V)
LXSU Current (Note 1) 3.6A
LXM Current (Note 1) 3.6A
LXSD Current (Note 1) 2.25A
REF, OSC, CC_ to GND -0.3V to (PVSU + 0.3V)
Operating Temperature Range -40°C to +85°C
Junction Temperature +150°C
Storage Temperature Range -65°C to +150°C
Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +70°C) 40-Pin Thin QFN 2105mW
Derates above +70°C
40-Pin Thin QFN 26.3mW/°C
Note 1: LXSU has internal clamp diodes to PVSU and PGSU, LXM has internal clamp diodes to PVM and PGM,
II. Manufacturing Information A. Description/Function: Six-Channel, High-Efficiency, Digital Camera Power Supplies B. Process: B8 (Standard 0.8 micron silicon gate CMOS) C. Number of Device Transistors: 9420 D. Fabrication Location: California, USA E. Assembly Location: Thailand F. Date of Initial Production: July, 2003
III. Packaging Information A. Package Type: 40-Lead Thin QFN (6 x 6) B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-Filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: # 05-9000-0520
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: 127 x 147 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Copper/Silicon D. Backside Metallization: None E. Minimum Metal Width: .8 microns (as drawn) F. Minimum Metal Spacing: .8 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Manager, Rel Oprations)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (l) is calculated as follows:
l = 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4389 x 48 x 2 Thermal acceleration factor assuming a 0.8eV activation energy l = 22.62 x 10-9 l= 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following
Burn-In Schematic (Spec. #06-6202) shows the static circuit used for this test. Maxim also performs 1000 hour
life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new
design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard
85°C/85%RH or HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing The PN07-1 die type has been found to have all pins able to withstand a transient pulse of +/-800V, per
Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX1567ETL
TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF IDENTIFICATION SIZE FAILURES
Static Life Test (Note 1) Ta = 135°C DC Parameters 48 0 Biased & functionality Time = 192 hrs.
Moisture Testing (Note 2) Pressure Pot Ta = 121°C DC Parameters 77 0 P = 15 psi. & functionality RH= 100% Time = 168hrs. 85/85 Ta = 85°C DC Parameters 77 0 RH = 85% & functionality Biased Time = 1000hrs.
Mechanical Stress (Note 2) Temperature -65°C/150°C DC Parameters 77 0 Cycle 1000 Cycles & functionality Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic package/process data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal
B. All pins except the one being tested and the ground pin(s) shall be open.
b. Each pin individually connected to terminal A with respect to each different set of a combination of all
named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins
except the one being tested and the power supply pin or set of pins shall be open.
c. Each input and each output individually connected to terminal A with respect to a combination of all the
other input and output pins connected to terminal B. All pins except the input or output pin being tested and
the combination of all the other input and output pins shall be open
Mil Std 883D
TERMINAL B
TERMINAL A
CURRENT
PROBE
(NOTE 6)
R = 1.5kW
C = 100pf
SHORT
R2
S2 R1
