IC Phoenix
 
Home ›  MM17 > M95010-WBN6P-M95010-WDW6-M95010-WDW6P-M95010-WDW6TP-M95010-WMN6P-M95010-WMN6TP-M95020-BN6-M95020-WMN6P-M95020-WMN6TP-M95040-MN3TP-M95040-MN6TP-M95040-WDW3TP-M95040-WDW6TG-M95040-WDW6TP-M95040-WMN3TP/W-M95040-WMN6P-M95040-WMN6TP,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WBN6P-M95010-WDW6-M95010-WDW6P-M95010-WDW6TP-M95010-WMN6P Fast Delivery,Good Price
Part Number:
If you need More Quantity or Better Price,Welcom Any inquiry.
We available via phone +865332716050 Email
Partno Mfg Dc Qty AvailableDescript
M95020-BN6 |M95020BN6STN/a1172avai2K serial SPI EEPROM with high speed clock
M95020-WMN6P |M95020WMN6PSTN/a11340avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-MN3TP |M95040MN3TPSTN/a1850avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WBN6P |M95010WBN6PSTN/a75avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WMN6P |M95010WMN6PSTN/a14950avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WDW6 |M95010WDW6STN/a2500avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WDW6P |M95010WDW6PSTN/a50avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WDW6TP |M95010WDW6TPSTN/a124000avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95010-WMN6TP |M95010WMN6TPSTMicroelectronicsN/a28300avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95020-WMN6TP |M95020WMN6TPSTN/a4364avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-MN6TP |M95040MN6TPSTN/a2379avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WDW3TP |M95040WDW3TPSTN/a7030avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WDW6TG |M95040WDW6TGSTN/a4000avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WDW6TP |M95040WDW6TPSTM ?N/a347316avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WMN3TP/W |M95040WMN3TPWSTN/a2022avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WMN6P |M95040WMN6PSTN/a70avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
M95040-WMN6TP |M95040WMN6TPSTMICROEN/a1216avai4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock


M95040-WDW6TP ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockFEATURES SUMMARY■ Compatible with SPI Bus Serial Interface Figure 1. Packages(Positive Clock SPI Mo ..
M95040-WMN3 ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockFEATURES . . . . 9Power-up . . . . . 9Power-down . . . 9Active Power and Sta ..
M95040-WMN3T ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockFEATURES SUMMARY . . . . . 1Table 1. Product List . . . . 1Figure 1. Packages . ..
M95040-WMN3TP/W ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockFEATURES SUMMARY■ Compatible with SPI Bus Serial Interface Figure 1. Packages(Positive Clock SPI Mo ..
M95040-WMN6 ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockFEATURES SUMMARY■ Compatible with SPI Bus Serial Interface Figure 1. Packages(Positive Clock SPI Mo ..
M95040-WMN6P ,4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed ClockLogic Diagram . . 5Figure 3. DIP, SO and TSSOP Connections . . 5Table 2. Signal Names ..
MAX1760HEUB+ ,0.8A, Low-Noise, 1MHz, Step-Up DC-DC ConverterMAX1760/MAX1760H19-1660; Rev 3; 1/070.8A, Low-Noise, 1MHz,Step-Up DC-DC Converter
MAX1761EEE ,Small, Dual, High-Efficiency Buck Controller for NotebooksELECTRICAL CHARACTERISTICS(Circuit of Figure 1, V+ = 15V, C = 4.7µF, C = 0.1µF, VL not externally d ..
MAX1761EEE ,Small, Dual, High-Efficiency Buck Controller for NotebooksApplicationsNotebooks and PDAsTOP VIEWDigital CamerasFB1 1 16 DH1Handy-TerminalsOUT1 2 15 CS1Smart ..
MAX1761EEE ,Small, Dual, High-Efficiency Buck Controller for Notebooksapplications, such as Flexible Output Voltagesnotebook computers and smart phones. OUT1: Dual Mode ..
MAX1761EEE+ ,Small, Dual, High-Efficiency Buck Controller for Notebooksapplications, such as♦ Flexible Output Voltagesnotebook computers and smart phones. OUT1: Dual Mode ..
MAX1762EUB ,High-Efficiency, 10-Pin レMAX, Step-Down Controllers for NotebooksApplications PART TEMP. RANGE PIN-PACKAGE Notebooks Handy-TerminalsMAX1762EUB -40°C to +85°C 10 µMA ..


M95010-WBN6P-M95010-WDW6-M95010-WDW6P-M95010-WDW6TP-M95010-WMN6P-M95010-WMN6TP-M95020-BN6-M95020-WMN6P-M95020-WMN6TP-M95040-MN3TP-M95040-MN6TP-M95040-WDW3TP-M95040-WDW6TG-M95040-WDW6TP-M95040-WMN3TP/W-M95040-WMN6P-M95040-WMN6TP
4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM With High Speed Clock
1/37October 2004
M95040
M95020, M95010

4Kbit, 2Kbit and 1Kbit Serial SPI Bus EEPROM
With High Speed Clock
FEATURES SUMMARY
Compatible with SPI Bus Serial Interface
(Positive Clock SPI Modes) Single Supply Voltage: 4.5 to 5.5V for M950x0 2.5 to 5.5V for M950x0-W 1.8 to 5.5V for M950x0-R High Speed 10MHz Clock Rate, 5ms Write Time Status Register BYTE and PAGE WRITE (up to 16 Bytes) Self-Timed Programming Cycle Adjustable Size Read-Only EEPROM Area Enhanced ESD Protection More than 1 Million Erase/Write Cycles More than 40-Year Data Retention
Table 1. Product List
Figure 1. Packages
M95040, M95020, M95010
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Figure 1. Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Figure 3. DIP, SO and TSSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Serial Data Output (Q). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
CONNECTING TO THE SPI BUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Figure 4. Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Figure 5. SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
OPERATING FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Active Power and Standby Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Hold Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Figure 6. Hold Condition Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 3. Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Data Protection and Protocol Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Table 4. Write-Protected Block Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Figure 7. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Table 5. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Figure 8. Write Enable (WREN) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3/37
M95040, M95020, M95010
Write Disable (WRDI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Figure 9. Write Disable (WRDI) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Read Status Register (RDSR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

WIP bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 10.Read Status Register (RDSR) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 11.Write Status Register (WRSR) Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Table 6. Address Range Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 12.Read from Memory Array (READ) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Write to Memory Array (WRITE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Figure 13.Byte Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 14.Page Write (WRITE) Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
POWER-UP AND DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Power-up State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Table 7. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 8. Operating Conditions (M950x0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 9. Operating Conditions (M950x0-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 10. Operating Conditions (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 11. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Figure 15.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 12. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Table 13. DC Characteristics (M950x0, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Table 14. DC Characteristics (M950x0, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Table 15. DC Characteristics (M950x0-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Table 16. DC Characteristics (M950x0-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 17. DC Characteristics (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 18. AC Characteristics (M950x0, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Table 19. AC Characteristics (M950x0, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Table 20. AC Characteristics (M950x0-W, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Table 21. AC Characteristics (M950x0-W, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Table 22. AC Characteristics (M950x0-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Figure 16.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Figure 17.Hold Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Figure 18.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Figure 19.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . .32
M95040, M95020, M95010
Table 23. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. . . . . . . . . .32
Figure 20.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . .33
Table 24. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
Figure 21.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . .34
Table 25. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . .34
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Table 26. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 27. How to Identify Present and Previous Products by the Process Identification Letter . . .35
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Table 28. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5/37
M95040, M95020, M95010
SUMMARY DESCRIPTION

The M95040 is a 4 Kbit (512 x 8) electrically eras-
able programmable memory (EEPROM), access-
ed by a high speed SPI-compatible bus. The other
members of the family (M95020 and M95010) are
identical, though proportionally smaller (2 and 1
Kbit, respectively).
Each device is accessed by a simple serial inter-
face that is SPI-compatible. The bus signals are C,
D and Q, as shown in Table 2. and Figure 2..
The device is selected when Chip Select (S) is tak-
en Low. Communications with the device can be
interrupted using Hold (HOLD). WRITE instruc-
tions are disabled by Write Protect (W).
Figure 2. Logic Diagram
Figure 3. DIP, SO and TSSOP Connections

Note: See PACKAGE MECHANICAL section for package dimen-
sions, and how to identify pin-1.
Table 2. Signal Names
M95040, M95020, M95010
SIGNAL DESCRIPTION

During all operations, VCC must be held stable and
within the specified valid range: VCC(min) to
VCC(max).
All of the input and output signals can be held High
or Low (according to voltages of VIH, VOH, VIL or
VOL, as specified in Table 13. to Table 17.). These
signals are described next.
Serial Data Output (Q).
This output signal is
used to transfer data serially out of the device.
Data is shifted out on the falling edge of Serial
Clock (C).
Serial Data Input (D).
This input signal is used to
transfer data serially into the device. It receives in-
structions, addresses, and the data to be written.
Values are latched on the rising edge of Serial
Clock (C).
Serial Clock (C).
This input signal provides the
timing of the serial interface. Instructions, address-
es, or data present at Serial Data Input (D) are
latched on the rising edge of Serial Clock (C). Data
on Serial Data Output (Q) changes after the falling
edge of Serial Clock (C).
Chip Select (S).
When this input signal is High,
the device is deselected and Serial Data Output
(Q) is at high impedance. Unless an internal Write
cycle is in progress, the device will be in the Stand-
by Power mode. Driving Chip Select (S) Low se-
lects the device, placing it in the Active Power
mode.
After Power-up, a falling edge on Chip Select (S)
is required prior to the start of any instruction.
Hold (HOLD).
The Hold (HOLD) signal is used to
pause any serial communications with the device
without deselecting the device.
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be se-
lected, with Chip Select (S) driven Low.
Write Protect (W).
This input signal is used to
control whether the memory is write protected.
When Write Protect (W) is held Low, writes to the
memory are disabled, but other operations remain
enabled. Write Protect (W) must either be driven
High or Low, but must not be left floating.
7/37
M95040, M95020, M95010
CONNECTING TO THE SPI BUS

These devices are fully compatible with the SPI
protocol.
All instructions, addresses and input data bytes
are shifted in to the device, most significant bit
first. The Serial Data Input (D) is sampled on the
first rising edge of the Serial Clock (C) after Chip
Select (S) goes Low.
All output data bytes are shifted out of the device,
most significant bit first. The Serial Data Output
(Q) is latched on the first falling edge of the Serial
Clock (C) after the instruction (such as the Read
from Memory Array and Read Status Register in-
structions) have been clocked into the device.
Figure 4. shows three devices, connected to an
MCU, on a SPI bus. Only one device is selected at
a time, so only one device drives the Serial Data
Output (Q) line at a time, all the others being high
impedance.
Figure 4. Bus Master and Memory Devices on the SPI Bus

Note: The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.
M95040, M95020, M95010
SPI Modes

These devices can be driven by a microcontroller
with its SPI peripheral running in either of the two
following modes: CPOL=0, CPHA=0 CPOL=1, CPHA=1
For these two modes, input data is latched in on
the rising edge of Serial Clock (C), and output data
is available from the falling edge of Serial Clock
(C).
The difference between the two modes, as shown
in Figure 5., is the clock polarity when the bus
master is in Stand-by mode and not transferring
data: C remains at 0 for (CPOL=0, CPHA=0) C remains at 1 for (CPOL=1, CPHA=1)
9/37
M95040, M95020, M95010
OPERATING FEATURES
Power-up

When the power supply is turned on, VCC rises
from VSS to VCC.
During this time, the Chip Select (S) must be al-
lowed to follow the VCC voltage. It must not be al-
lowed to float, but should be connected to VCC via
a suitable pull-up resistor.
As a built in safety feature, Chip Select (S) is edge
sensitive as well as level sensitive. After Power-
up, the device does not become selected until a
falling edge has first been detected on Chip Select
(S). This ensures that Chip Select (S) must have
been High, prior to going Low to start the first op-
eration.
Power-down

At Power-down, the device must be deselected.
Chip Select (S) should be allowed to follow the
voltage applied on VCC.
Active Power and Standby Power Modes

When Chip Select (S) is Low, the device is select-
ed, and in the Active Power mode. The device
consumes ICC, as specified in Table 13. to Table
When Chip Select (S) is High, the device is dese-
lected. If an Erase/Write cycle is not currently in
progress, the device then goes in to the Standby
Power mode, and the device consumption drops
to ICC1.
Hold Condition

The Hold (HOLD) signal is used to pause any se-
rial communications with the device without reset-
ting the clocking sequence.
During the Hold condition, the Serial Data Output
(Q) is high impedance, and Serial Data Input (D)
and Serial Clock (C) are Don’t Care.
To enter the Hold condition, the device must be
selected, with Chip Select (S) Low.
Normally, the device is kept selected, for the whole
duration of the Hold condition. Deselecting the de-
vice while it is in the Hold condition, has the effect
of resetting the state of the device, and this mech-
anism can be used if it is required to reset any pro-
cesses that had been in progress.
The Hold condition starts when the Hold (HOLD)
signal is driven Low at the same time as Serial
Clock (C) already being Low (as shown in Figure
6.).
The Hold condition ends when the Hold (HOLD)
signal is driven High at the same time as Serial
Clock (C) already being Low.
Figure 6. also shows what happens if the rising
and falling edges are not timed to coincide with
Serial Clock (C) being Low.
M95040, M95020, M95010
Status Register

Figure 7. shows the position of the Status Register
in the control logic of the device. This register con-
tains a number of control bits and status bits, as
shown in Table 3..
Bits b7, b6, b5 and b4 are always read as 1.
WIP bit.
The Write In Progress bit is a volatile
read-only bit that is automatically set and reset by
the internal logic of the device. When set to a 1, it
indicates that the memory is busy with a Write cy-
cle.
WEL bit.
The Write Enable Latch bit is a volatile
read-only bit that is set and reset by specific in-
structions. When reset to 0, no WRITE or WRSR
instructions are accepted by the device.
BP1, BP0 bits.
The Block Protect bits are non-
volatile read-write bits. These bits define the area
of memory that is protected against the execution
of Write cycles, as summarized in Table 4..
Table 3. Status Register Format
Data Protection and Protocol Control

To help protect the device from data corruption in
noisy or poorly controlled environments, a number
of safety features have been built in to the device.
The main security measures can be summarized
as follows: The WEL bit is reset at power-up. Chip Select (S) must rise after the eighth clock
count (or multiple thereof) in order to start a
non-volatile Write cycle (in the memory array
or in the Status Register). Accesses to the memory array are ignored
during the non-volatile programming cycle,
and the programming cycle continues
unaffected. Invalid Chip Select (S) and Hold (HOLD)
transitions are ignored.
For any instruction to be accepted and executed,
Chip Select (S) must be driven High after the rising
edge of Serial Clock (C) that latches the last bit of
the instruction, and before the next rising edge of
Serial Clock (C).
For this, “the last bit of the instruction” can be the
eighth bit of the instruction code, or the eighth bit
of a data byte, depending on the instruction (ex-
cept in the case of RDSR and READ instructions).
Moreover, the "next rising edge of CLOCK" might
(or might not) be the next bus transaction for some
other device on the bus.
When a Write cycle is in progress, the device pro-
tects it against external interruption by ignoring
any subsequent READ, WRITE or WRSR instruc-
tion until the present cycle is complete.
Table 4. Write-Protected Block Size

b7 b0
Write In Progress Bit
11/37
M95040, M95020, M95010
MEMORY ORGANIZATION

The memory is organized as shown in Figure 7..
M95040, M95020, M95010
INSTRUCTIONS

Each instruction starts with a single-byte code, as
summarized in Table 5..
If an invalid instruction is sent (one not contained
in Table 5.), the device automatically deselects it-
self.
Table 5. Instruction Set

Note:1. A8 = 1 for the upper half of the memory array of the
M95040, and 0 for the lower half, and is Don’t Care for
other devices. X = Don’t Care.
13/37
M95040, M95020, M95010
Write Enable (WREN)

The Write Enable Latch (WEL) bit must be set pri-
or to each WRITE and WRSR instruction. The only
way to do this is to send a Write Enable instruction
to the device.
As shown in Figure 8., to send this instruction to
the device, Chip Select (S) is driven Low, and the
bits of the instruction byte are shifted in, on Serial
Data Input (D). The device then enters a wait
state. It waits for a the device to be deselected, by
Chip Select (S) being driven High.
Figure 8. Write Enable (WREN) Sequence
Write Disable (WRDI)

One way of resetting the Write Enable Latch
(WEL) bit is to send a Write Disable instruction to
the device.
As shown in Figure 9., to send this instruction to
the device, Chip Select (S) is driven Low, and the
bits of the instruction byte are shifted in, on Serial
Data Input (D).
The device then enters a wait state. It waits for a
the device to be deselected, by Chip Select (S) be-
ing driven High.
The Write Enable Latch (WEL) bit, in fact, be-
comes reset by any of the following events:
–Power-up WRDI instruction execution WRSR instruction completion WRITE instruction completion Write Protect (W) line being held Low.
Figure 9. Write Disable (WRDI) Sequence
M95040, M95020, M95010
Read Status Register (RDSR)

One of the major uses of this instruction is to allow
the MCU to poll the state of the Write In Progress
(WIP) bit. This is needed because the device will
not accept further WRITE or WRSR instructions
when the previous Write cycle is not yet finished.
As shown in Figure 10., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte are then shifted in, on
Serial Data Input (D). The current state of the bits
in the Status Register is shifted out, on Serial Data
Out (Q). The Read Cycle is terminated by driving
Chip Select (S) High.
The Status Register may be read at any time, even
during a Write cycle (whether it be to the memory
area or to the Status Register). All bits of the Sta-
tus Register remain valid, and can be read using
the RDSR instruction. However, during the current
Write cycle, the values of the non-volatile bits
(BP0, BP1) become frozen at a constant value.
The updated value of these bits becomes avail-
able when a new RDSR instruction is executed, af-
ter completion of the Write cycle. On the other
hand, the two read-only bits (Write Enable Latch
(WEL), Write In Progress (WIP)) are dynamically
updated during the on-going Write cycle.
The status and control bits of the Status Register
are as follows:
WIP bit.
The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write or Write
Status Register cycle. When set to 1, such a cycle
is in progress, when reset to 0 no such cycle is in
progress.
WEL bit.
The Write Enable Latch (WEL) bit indi-
cates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is
set, when set to 0 the internal Write Enable Latch
is reset and no Write or Write Status Register in-
struction is accepted.
BP1, BP0 bits.
The Block Protect (BP1, BP0) bits
are non-volatile. They define the size of the area to
be software protected against Write instructions.
These bits are written with the Write Status Regis-
ter (WRSR) instruction. When one or both of the
Block Protect (BP1, BP0) bits is set to 1, the rele-
vant memory area (as defined in Table 4.) be-
comes protected against Write (WRITE)
instructions. The Block Protect (BP1, BP0) bits
can be written provided that the Hardware Protect-
ed mode has not been set.
15/37
M95040, M95020, M95010
Write Status Register (WRSR)

This instruction has no effect on bits b7, b6, b5, b4,
b1 and b0 of the Status Register.
As shown in Figure 11., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte and data byte are then
shifted in on Serial Data Input (D).
The instruction is terminated by driving Chip Se-
lect (S) High. Chip Select (S) must be driven High
after the rising edge of Serial Clock (C) that latch-
es the eighth bit of the data byte, and before the
the next rising edge of Serial Clock (C). If this con-
dition is not met, the Write Status Register
(WRSR) instruction is not executed. The self-
timed Write Cycle starts, and continues for a peri-
od tW (as specified in Table 18. to Table 22.), at
the end of which the Write in Progress (WIP) bit is
reset to 0.
The instruction is not accepted, and is not execut-
ed, under the following conditions: if the Write Enable Latch (WEL) bit has not
been set to 1 (by executing a Write Enable
instruction just before) if a Write Cycle is already in progress if the device has not been deselected, by Chip
Select (S) being driven High, after the eighth
bit, b0, of the data byte has been latched in if Write Protect (W) is Low.
M95040, M95020, M95010
Read from Memory Array (READ)

As shown in Figure 12., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte and address byte are
then shifted in, on Serial Data Input (D). For the
M95040, the most significant address bit, A8, is in-
corporated as bit b3 of the instruction byte, as
shown in Table 5.. The address is loaded into an
internal address register, and the byte of data at
that address is shifted out, on Serial Data Output
(Q).
If Chip Select (S) continues to be driven Low, an
internal bit-pointer is automatically incremented at
each clock cycle, and the corresponding data bit is
shifted out.
When the highest address is reached, the address
counter rolls over to zero, allowing the Read cycle
to be continued indefinitely. The whole memory
can, therefore, be read with a single READ instruc-
tion.
The Read cycle is terminated by driving Chip Se-
lect (S) High. The rising edge of the Chip Select
(S) signal can occur at any time during the cycle.
The first byte addressed can be any byte within
any page.
The instruction is not accepted, and is not execut-
ed, if a Write cycle is currently in progress.
Table 6. Address Range Bits
Figure 12. Read from Memory Array (READ) Sequence

Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.
17/37
M95040, M95020, M95010
Write to Memory Array (WRITE)

As shown in Figure 13., to send this instruction to
the device, Chip Select (S) is first driven Low. The
bits of the instruction byte, address byte, and at
least one data byte are then shifted in, on Serial
Data Input (D).
The instruction is terminated by driving Chip Se-
lect (S) High after the rising edge of Serial Clock
(C) that latches the last data bit, and before the
next rising edge of Serial Clock (C) occurs any-
where on the bus. In the case of Figure 13., this
occurs after the eighth bit of the data byte has
been latched in, indicating that the instruction is
being used to write a single byte. The self-timed
Write cycle starts, and continues for a period tWC
(as specified in Table 18. to Table 22.), at the end
of which the Write in Progress (WIP) bit is reset to
If, though, Chip Select (S) continues to be driven
Low, as shown in Figure 14., the next byte of input
data is shifted in. In this way, all the bytes from the
given address to the end of the same page can be
programmed in a single instruction.
If Chip Select (S) still continues to be driven Low,
the next byte of input data is shifted in, and is used
to overwrite the byte at the start of the current
page.
The instruction is not accepted, and is not execut-
ed, under the following conditions: if the Write Enable Latch (WEL) bit has not
been set to 1 (by executing a Write Enable
instruction just before) if a Write cycle is already in progress if the device has not been deselected, by Chip
Select (S) being driven High, at a byte
boundary (after the rising edge of Serial Clock
(C) that latches the last data bit, and before
the next rising edge of Serial Clock (C) occurs
anywhere on the bus) if Write Protect (W) is Low or if the addressed
page is in the region protected by the Block
Protect (BP1 and BP0) bits.
Figure 13. Byte Write (WRITE) Sequence

Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.
M95040, M95020, M95010
Figure 14. Page Write (WRITE) Sequence

Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.
19/37
M95040, M95020, M95010
POWER-UP AND DELIVERY STATE
Power-up State

After Power-up, the device is in the following state: low power Standby Power mode deselected (after Power-up, a falling edge is
required on Chip Select (S) before any
instructions can be started). not in the Hold Condition the Write Enable Latch (WEL) is reset to 0 Write In Progress (WIP) is reset to 0
The BP1 and BP0 bits of the Status Register are
unchanged from the previous power-down (they
are non-volatile bits).
Initial Delivery State

The device is delivered with the memory array set
at all 1s (FFh). The Block Protect (BP1 and BP0)
bits are initialized to 0.
ic,good price


TEL:86-533-2716050      FAX:86-533-2716790
   

©2020 IC PHOENIX CO.,LIMITED