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LSG F971 |LSGF971OSRAMN/a30000avaiMulti ChipLED
LSGF971OSRAMN/a30000avaiMulti ChipLED


LSG F971 ,Multi ChipLEDApplications● hand phone back lighting● coupling in any light pipe● LCD back lighting● switch back ..
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LSG F971-LSGF971
Multi ChipLED

CHIPLEDLSGF971
Vorläufige Daten / Preliminary Data
Opto Semiconductors
Besondere Merkmale
Farbe: super-rot (628 nm) und grün (572 nm)Farbmischung möglichChips getrennt ansteuerbarIndustriestandard bzgl. Lötpadrasterfür alle SMT Bestück- und IR-Löttechniken geeignetgeringe Bauteilhöhegegurtet (8-mm-Filmgurt)
Features
colors: super-red (628 nm) and green (572 nm)color mixing is possibleeach chip can be controlled separatelyindustry standard footprintsuitable for all SMT assembly and IR soldering methodslow profileavailable taped on reel (8 mm tape)
Anwendungen
Handy-HinterleuchtungEinkopplung in LichtleiterLCD-HinterleuchtungSchalter-HinterleuchtungSpielsachenArmbanduhrenTaschenrechner
Applications
hand phone back lightingcoupling in any light pipeLCD back lightingswitch back lightingtoyswatchespocket calculators
LSGF971
Opto Semiconductors
Grenzwerte
Maximum Ratings
nur ein Chip betrieben
one system only
LSGF971
Opto Semiconductors
Kennwerte (TA = 25 °C)
Characteristics
LSGF971
Opto Semiconductors
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 20 mA
Relative spectral emission

V(λ) =spektrale Augenempfindlichkeit
standard eye response curve
Abstrahlcharakteristik I
rel = f (ϕ)
Radiation characteristic
LSGF971
Opto Semiconductors
Durchlaßstrom IF = f
(VF)
Forward current

TA = 25 °C
Maximal zulässiger Durchlaßstrom
Max. permissible forward current
F = f (TA)
Relative Lichtstärke IV/IV(20 mA) = f
(IF)
Relative luminous intensity

TA = 25 °C
LSGF971
Opto Semiconductors
Empfehlung Lötpaddesign Infrarot/Vapor-Phase Reflow-Lötung
Recommended Pad Infrared Vapor-Phase Reflow-Soldering

Empfohlenes Lötprofil
nach CECC 00802 für Infrarot/Vapor-Phase Reflow-Lötung
Recommended Soldering Profile
acc. to CECC 00802 for Infrared Vapor-Phase Reflow-Soldering

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