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LPC3152FET208NXPN/a100avaiARM926EJ-S with 192 kB SRAM, USB High-speed (OTG, Host, Device), SD/MMC, NAND flash controller
LPC3154FET208NXPN/a457avaiARM926EJ-S with 192 kB SRAM, USB High-speed (OTG, Host, Device), SD/MMC, NAND flash controller, AES


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LPC3152FET208-LPC3154FET208
ARM926EJ-S with 192 kB SRAM, USB High-speed (OTG, Host, Device), SD/MMC, NAND flash controller
1. General description
The NXP LPC3152/3154 combine an 180 MHz ARM926EJ-S CPU core, High-speed USB
2.0 OTG, 192 kB SRAM, NAND flash controller, flexible external bus interface, an
integrated audio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and
parallel interfaces in a single chip targeted at consumer, industrial, medical, and
communication markets. T o optimize system power consumption, the LPC3152/3154
have multiple power domains and a very flexible Clock Generation Unit (CGU) that
provides dynamic clock gating and scaling.
The LPC3152/3154 are implemented as a multi-chip module with two side-by-side dies,
one for digital functions and one for analog functions, which include Power Supply Unit
(PSU), audio codec, RTC, and Li-ion battery charger.
2. Features and benefits
2.1 Key features
CPU platform 180 MHz, 32-bit ARM926EJ-S 16 kB D-cache and 16 kB I-cache Memory Management Unit (MMU) Internal memory 192 kB embedded SRAM External memory interface NAND flash controller with 8-bit ECC and AES decryption engine (LPC3154 only) 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM Security AES decryption engine (LPC3154 only) Secure one-time programmable memory for AES key storage and customer use 128 bit unique ID per device for DRM schemes Communication and connectivity High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY Two I2 S-bus interfaces Integrated master/slave SPI Two master/slave I2 C-bus interfaces Fast UART Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
LPC3152/3154
ARM926EJ microcontrollers with USB High-speed OTG,
SD/MMC, NAND flash controller, and audio codec
Rev. 1 — 31 May 2012 Product data sheet
NXP Semiconductors LPC3152/3154
ARM926EJ microcontrollers
Three-channel 10-bit ADC Integrated 4/8/16-bit 6800/8080 compatible LCD interface Integrated audio codec with stereo ADC and Class AB headphone amplifier System functions Dynamic clock gating and scaling Multiple power domains Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB On the LPC3154 only: secure booting using AES decryption engine from SPI flash,
NAND flash, SD/MMC cards, UART, or USB DMA controller Four 32-bit timers Watchdog timer PWM module Master/slave PCM interface Random Number Generator (RNG) General Purpose I/O (GPIO) pins Flexible and versatile interrupt structure JTAG interface with boundary scan and ARM debug access Real-Time Clock (RTC) Power supply Integrated power supply unit Li-ion charger USB charge pump Operating voltage and temperature Core voltage: 1.2 V I/O voltage: 1.8 V, 3.3 V Temperature: 40 C to +85C TFBGA208 package: 12 12 mm2 , 0.7 mm pitch
3. Ordering information
Table 1. Ordering information
LPC3152FET208 TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
body 12 x 12 x 0.7 mm
SOT930-1
LPC3154FET208 TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
body 12 x 12 x 0.7 mm
SOT930-1
NXP Semiconductors LPC3152/3154
ARM926EJ microcontrollers
3.1 Ordering options
Table 2. Ordering options for LPC3152/54
LPC3152FET208 192 kB yes no Device/
Host/OTG yes yes 208 40 C to
+85C
LPC3154FET208 192 kB yes yes Device/
Host/OTG yes yes 208 40 C to
+85C
NXP Semiconductors LPC3152/3154
ARM926EJ microcontrollers
4. Block diagram

NXP Semiconductors LPC3152/3154
ARM926EJ microcontrollers
5. Pinning information
5.1 Pinning

Table 3. Pin allocation table

Pin names with prefix m are multiplexed pins. See Table 11 for pin function selection of multiplexed pins.
Row A
Row B
Row C
Row D
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