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LIS352AXTRQFNN/a309avaiMEMS inertial sensor, 3-axis


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LIS352AXTR
MEMS inertial sensor, 3-axis

February 2010 Doc ID 15530 Rev 2 1/15
LIS352AX

MEMS inertial sensor:
3-axis ±2 g absolute analog-output "piccolo" accelerometer
Features
Absolute 0-g level and sensitivity Excellent stability over temperature 3 acceleration channels plus multiplexed
analog output Factory-trimmed device sensitivity and
0-g level Power-down mode Embedded self-test 10000 g high shock survivability ECOPACK® RoHS and “Green” compliant
(see Section6)
Applications
Free-fall detection for data protection Tilting applications Mobile and battery-operated terminals Gaming and virtual reality input devices Anti-theft systems and Inertial navigation
Description

The LIS352AX is a new small size, low-power 3-
axis linear accelerometer that includes a sensing
element and an IC interface capable of providing
an absolute analog signal to the external world.
The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit trimmed to better match
the sensing element characteristics.
The LIS352AX has a full-scale of ±2 g and is
capable of measuring accelerations over a
maximum bandwidth of 2.0 kHz. The device
bandwidth may be reduced by using external
capacitors.
The self-test capability allows the user to check
the functioning of the system.
An embedded multiplexer allows the redirection of
the analog outputs onto a single pin for operation
with a single-channel A/D converter.
ST is already in the field with several hundred
million sensors which have received excellent
acceptance from the market in terms of quality,
reliability and performance.
The LIS352AX is provided in a plastic land grid
array (LGA) package.
Several years ago ST successfully pioneered the
use of this package for accelerometers. Today, ST
has the widest manufacturing capability and
strongest expertise in the world for production of
sensors in plastic LGA packages.
Table 1. Device summary

Contents LIS352AX

2/15 Doc ID 15530 Rev 2
Contents Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Pin connections and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 T erminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 Output impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LIS352AX Block diagram and pin description
Doc ID 15530 Rev 2 3/15
Block diagram and pin description
Figure 1. Block diagram
1.1 Pin connections and description
Figure 2. Pin connection

Block diagram and pin description LIS352AX

4/15 Doc ID 15530 Rev 2
Table 2. Pin description
LIS352AX Mechanical and electrical specifications
Doc ID 15530 Rev 2 5/15
Mechanical and electrical specifications
2.1 Mechanical characteristics

@ Vdd=3.3 V, T=25 °C unless otherwise noted(a) The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table4.
Table 3. Mechanical characteristics
Typical specifications are not guaranteed Guaranteed by wafer level test and measurement of initial offset and sensitivity Zero-g level and sensitivity are absolute to supply voltage Guaranteed by design Contribution to the measuring output of an inclination/acceleration along any perpendicular axis Self-test output voltage change” is defined as Vout(Vst=Logic1)-Vout(Vst=Logic0) Minimum resonance frequency FRES=2.0 kHz. Sensor bandwidth=1/(2*π*32kΩ*CLOAD), with CLOAD>2.5nF

Mechanical and electrical specifications LIS352AX

6/15 Doc ID 15530 Rev 2
2.2 Electrical characteristics

@ Vdd=3.3 V, T=25 °C unless otherwise noted(b) The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table3.
Table 4. Electrical characteristics
Typical specifications are not guaranteed Minimum resonance frequency FRES=2.0 kHz. Device bandwidth=1/(2*π*32kΩ*CLOAD), with CLOAD>2.5nF
LIS352AX Absolute maximum ratings
Doc ID 15530 Rev 2 7/15
Absolute maximum ratings
Stresses above those listed as “Absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Note: Supply voltage on any pin should never exceed 6.0 V.

Table 5. Absolute maximum ratings

This is a mechanical shock sensitive device, improper handling can cause permanent
damages to the part
This is an ESD sensitive device, improper handling can cause permanent damages to
the part

Absolute maximum ratings LIS352AX

8/15 Doc ID 15530 Rev 2
3.1 Terminology
3.2 Sensitivity

Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. Because the sensor can measure DC accelerations, this can be done
easily by pointing the selected axis towards the ground, noting the output value, rotating the
sensor 180 degrees (pointing towards the sky) and noting the output value again. By doing
so, a ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, produces the actual sensitivity of the sensor. This
value changes very little over temperature (see sensitivity change vs. temperature) and over
time. The sensitivity tolerance describes the range of sensitivities of a large number of
sensors.
3.3 Zero-g level

Zero-g level describes the actual output signal if there is no acceleration present. A sensor
in a steady state on a horizontal surface will measure 0 g on both the X and Y axes,
whereas the Z axis will measure 1 g. A deviation from the ideal 0-g level (1250 mV, in this
case) is called Zero-g offset. Offset is to some extent a result of stress to the MEMS sensor
and therefore the offset can slightly change after mounting the sensor onto a printed circuit
board or exposing it to extensive mechanical stress. Offset changes little over temperature
(see “Zero-g level change vs. temperature” in Table 3: Mechanical characteristics). The
Zero-g level of an individual sensor is also very stable over its lifetime. The Zero-g level
tolerance describes the range of Zero-g levels of a group of sensors.
3.4 Self-test

Self-test (ST) provides a means of testing of the mechanical and electrical parts of the
sensor, allowing the seismic mass to be moved by through an electrostatic test-force. The
self-test function is off when the ST pin is connected to GND. When the ST pin is tied at
Vdd, an actuation force is applied to the sensor, simulating a definite input acceleration. In
this case the sensor outputs exhibits a voltage change in its DC levels. When ST is
activated, the device output level is given by the algebraic sum of the signals produced by
the acceleration acting on the sensor and by the electrostatic test-force. If the output signals
change within the amplitude specified in Table 3, then the sensor is working properly and
the parameters of the interface chip are within the defined specifications.
3.5 Output impedance

Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 2.5 nF and the internal
resistor. Due to the resistor level, only small inexpensive external capacitors are needed to
generate low corner frequencies. When interfacing with an ADC, it is important to use high
input impedance input circuitries to avoid measurement errors. Note that the minimum load
capacitance forms a corner frequency close to the resonant frequency of the sensor. In
general, the smallest possible bandwidth for a particular application should be chosen to
obtain the best results.
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