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IRFW730BTMFAIRCHILDN/a650avai400V N-Channel B-FET / Substitute of IRFW730A


IRFW730BTM ,400V N-Channel B-FET / Substitute of IRFW730AFeaturesThese N-Channel enhancement mode power field effect • 5.5A, 400V, R = 1.0Ω @V = 10 VDS(on) ..
IRFW740 ,400V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 10A, 400V, R = 0.54Ω @V = 10 VDS(on) ..
IRFW820B ,500V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 2.5A, 500V, R = 2.6Ω @V = 10 VDS(on) ..
IRFW820BTM ,500V N-Channel B-FET / Substitute of IRFW820AFeaturesThese N-Channel enhancement mode power field effect • 2.5A, 500V, R = 2.6Ω @V = 10 VDS(on) ..
IRFW830B ,500V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 4.5A, 500V, R = 1.5Ω @V = 10 VDS(on) ..
IRFW830BTM ,500V N-Channel B-FET / Substitute of IRFW830AFeaturesThese N-Channel enhancement mode power field effect • 4.5A, 500V, R = 1.5Ω @V = 10 VDS(on) ..
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IRFW730BTM
400V N-Channel B-FET / Substitute of IRFW730A
IRFW730B / IRFI730B November 2001 IRFW730B / IRFI730B 400V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 5.5A, 400V, R = 1.0Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 25 nC) planar, DMOS technology. • Low Crss ( typical 20 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supplies and electronic lamp ballasts based on half bridge. D !!!!!!!! D ● ● ● ● ● ● ● ● ◀ ◀ ◀ ◀ ◀ ◀ ◀ ◀ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ● ● ● ● ● ● ● ● G!!!!!!!! ● ● ● ● ● ● ● ● 2 2 GS D -PAK I -PAK GS D !!!!!!!! IRFW Series IRFI Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter IRFW730B / IRFI730B Units V Drain-Source Voltage 400 V DSS I - Continuous (T = 25°C) Drain Current 5.5 A D C - Continuous (T = 100°C) 3.5 A C I (Note 1) Drain Current - Pulsed 22 A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 330 mJ AS I Avalanche Current (Note 1) 5.5 A AR E (Note 1) Repetitive Avalanche Energy 7.3 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns Power Dissipation (T = 25°C) * 3.13 W P A D Power Dissipation (T = 25°C) 73 W C - Derate above 25°C 0.58 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J stg Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 1.71 °C/W θJC R Thermal Resistance, Junction-to-Ambient * -- 40 °C/W θJA R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA * When mounted on the minimum pad size recommended (PCB Mount) ©2001 Rev. B, November 2001
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