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IRF740BFSCN/a10000avai400V N-Channel MOSFET


IRF740B ,400V N-Channel MOSFETIRF740B/IRFS740BNovember 2001IRF740B/IRFS740B400V N-Channel MOSFET
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IRF740B
400V N-Channel MOSFET
IRF740B/IRFS740B November 2001 IRF740B/IRFS740B 400V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 10A, 400V, R = 0.54Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 41 nC) planar, DMOS technology. • Low Crss ( typical 35 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supplies and electronic lamp ballasts based on half bridge. D G TO-220 TO-220F G D S G D S IRF Series IRFS Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter IRF740B IRFS740B Units V Drain-Source Voltage 400 V DSS I - Continuous (T = 25°C) Drain Current 10 10 * A D C - Continuous (T = 100°C) 6.3 6.3 * A C I (Note 1) Drain Current - Pulsed 40 40 * A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 450 mJ AS I Avalanche Current (Note 1) 10 A AR E (Note 1) Repetitive Avalanche Energy 13.4 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns P Power Dissipation (T = 25°C) 134 44 W D C - Derate above 25°C 1.08 0.35 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds * Drain current limited by maximum junction temperature Thermal Characteristics Symbol Parameter IRF740B IRFS740B Units R Thermal Resistance, Junction-to-Case 0.93 2.86 °C/W θJC R Thermal Resistance, Case-to-Sink 0.5 -- °C/W θCS R Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W θJA ©2001 Rev. A, November 2001
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