| Partno |
Mfg |
Dc |
Qty |
Available | Descript |
| HSM2694-3UL-E |
RENESAS |
N/a |
10000 |
 |
|
HSM276S , MPAK package is suitable for high density surface mounting and high speed assembly
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HSM88AS , MPAK package is suitable for high density surface mounting and high speed assembly
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