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FQB8N60CFAIRCHILDN/a300avai600V N-Channel Advance Q-FET C-Series
FQB8N60CTMFairchildN/a4800avai600V N-Channel Advance Q-FET C-Series


FQB8N60CTM ,600V N-Channel Advance Q-FET C-SeriesFeaturesThese N-Channel enhancement mode power field effect  7.5A, 600V, R = 1.2Ω @V = 10 VDS(on) ..
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FQB8N60C-FQB8N60CTM
600V N-Channel Advance Q-FET C-Series
FQB8N60C / FQI8N60C TM QFET FQB8N60C / FQI8N60C 600V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect  7.5A, 600V, R = 1.2Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary,  Low gate charge ( typical 28 nC) planar stripe, DMOS technology.  Low Crss ( typical 12 pF) This advanced technology has been especially tailored to  Fast switching minimize on-state resistance, provide superior switching  100% avalanche tested performance, and withstand high energy pulse in the  Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switched mode power supplies, active power factor correction, electronic lamp ballasts based on half bridge topology. D !!!!!!!! D ● ● ● ● ● ● ● ● ◀ ◀ ◀ ◀ ◀ ◀ ◀ ◀ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ▲ ● ● ● ● ● ● ● ● G!!!!!!!! 2 ● ● ● ● ● ● ● ● 2 I -PAK D -PAK GS FQI Series FQB Series GS D !!!!!!!! S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQB8N60C / FQI8N60C Units V Drain-Source Voltage 600 V DSS I - Continuous (T = 25°C) Drain Current 7.5 A D C - Continuous (T = 100°C) 4.6 A C I (Note 1) Drain Current - Pulsed 30 A DM V Gate-Source Voltage ± 30 V GSS E Single Pulsed Avalanche Energy (Note 2) 230 mJ AS I Avalanche Current (Note 1) 7.5 A AR E Repetitive Avalanche Energy (Note 1) 14.7 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns Power Dissipation (T = 25°C)* 3.13 W A P Power Dissipation (T = 25°C) 147 W D C - Derate above 25°C 1.18 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 0.85 °C/W θJC R Thermal Resistance, Junction-to-Ambient* -- 40 °C/W θJA R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA * When mounted on the minimum pad size recommended (PCB Mount) ©2003 Rev. A, October 2003
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