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FQB8N25FAIRCHILDN/a525avai250V N-Channel MOSFET


FQB8N25 ,250V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 8.0A, 250V, R = 0.55Ω @V = 10 VDS(on) ..
FQB8N25TM ,250V N-Channel QFETFeaturesThese N-Channel enhancement mode power field effect • 8.0A, 250V, R = 0.55Ω @V = 10 VDS(on) ..
FQB8N60C ,600V N-Channel Advance Q-FET C-SeriesFQB8N60C / FQI8N60CTMQFETFQB8N60C / FQI8N60C600V N-Channel MOSFET
FQB8N60CTM ,600V N-Channel Advance Q-FET C-SeriesFeaturesThese N-Channel enhancement mode power field effect  7.5A, 600V, R = 1.2Ω @V = 10 VDS(on) ..
FQB8P10 ,100V P-Channel MOSFETapplications such as audio amplifier,high efficiency switching DC/DC converters, and DC motorcontro ..
FQB8P10TM ,100V P-Channel QFETapplications such as audio amplifier,high efficiency switching DC/DC converters, and DC motorcontro ..
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FQB8N25
250V N-Channel MOSFET
May 2000 TM QFET QFET QFET QFET FQB8N25 / FQI8N25 250V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect • 8.0A, 250V, R = 0.55Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 12 nC) planar stripe, DMOS technology. • Low Crss ( typical 11 pF) This advanced technology has been especially tailored to • Fast switching minimize on-state resistance, provide superior switching • 100% avalanche tested performance, and withstand high energy pulse in the • Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters, switch mode power supply. D D ! ! "" !!"" "" G! ! "" G S 2 2 D -PAK I -PAK G D S ! ! FQB Series FQI Series S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQB8N25 / FQI8N25 Units V Drain-Source Voltage 250 V DSS I - Continuous (T = 25°C) Drain Current 8.0 A D C - Continuous (T = 100°C) 5.0 A C I (Note 1) Drain Current - Pulsed 32 A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 120 mJ AS I Avalanche Current (Note 1) 8.0 A AR E (Note 1) Repetitive Avalanche Energy 8.7 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns Power Dissipation (T = 25°C) * 3.13 W P A D Power Dissipation (T = 25°C) 87 W C - Derate above 25°C 0.69 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 1.44 °C/W θJC R Thermal Resistance, Junction-to-Ambient * -- 40 °C/W θJA R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA * When mounted on the minimum pad size recommended (PCB Mount) ©2000 Fairchild Semiconductor International Rev. A, May 2000 FQB8N25 / FQI8N25
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