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FQB10N20CFAIRCHILN/a4800avai200V N-Channel Advance QFET C-series
FQB10N20CTMFAIRCN/a800avai200V N-Channel Advance QFET C-series


FQB10N20C ,200V N-Channel Advance QFET C-seriesFeaturesThese N-Channel enhancement mode power field effect  9.5A, 200V, R = 0.36Ω @V = 10 VDS(on) ..
FQB10N20CTM ,200V N-Channel Advance QFET C-seriesFQB10N20C/FQI10N20C TMQFETFQB10N20C/FQI10N20C200V N-Channel MOSFET
FQB10N20L ,200V LOGIC N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect  10A, 200V, R = 0.36Ω @V = 10 VDS(on) ..
FQB10N60C ,600V N-Channel Advance Q-FET C-SeriesFeaturesThese N-Channel enhancement mode power field effect  9.5A, 600V, R = 0.73Ω @V = 10 VDS(on) ..
FQB11N40 ,400V N-Channel MOSFETFeaturesThese N-Channel enhancement mode power field effect • 11.4A, 400V, R = 0.48Ω @V = 10 VDS(on ..
FQB11N40C ,400V N-Channel Advance Q-FET C-SeriesFeaturesThese N-Channel enhancement mode power field effect • 10.5 A, 400V, R = 0.5 Ω @V = 10 VD ..
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FQB10N20C-FQB10N20CTM
200V N-Channel Advance QFET C-series
FQB10N20C/FQI10N20C TM QFET FQB10N20C/FQI10N20C 200V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect  9.5A, 200V, R = 0.36Ω @V = 10 V DS(on) GS transistors are produced using Fairchild’s proprietary,  Low gate charge ( typical 20 nC) planar stripe, DMOS technology.  Low Crss ( typical 40.5 pF) This advanced technology has been especially tailored to  Fast switching minimize on-state resistance, provide superior switching  100% avalanche tested performance, and withstand high energy pulse in the  Improved dv/dt capability avalanche and commutation mode. These devices are well suited for high efficiency switching DC/DC converters, switch mode power supplies, DC-AC converters for uninterrupted power supplies and motor controls. D ! ! D "" !!"" "" G! ! "" 2 2 I -PAK D -PAK GS FQI Series ! ! FQB Series GS D S Absolute Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter FQB10N20C/FQI10N20C Units V Drain-Source Voltage 200 V DSS I - Continuous (T = 25°C) Drain Current 9.5 A D C - Continuous (T = 100°C) 6.0 A C I (Note 1) Drain Current - Pulsed 38 A DM V Gate-Source Voltage ± 30 V GSS E (Note 2) Single Pulsed Avalanche Energy 210 mJ AS I Avalanche Current (Note 1) 9.5 A AR E (Note 1) Repetitive Avalanche Energy 7.2 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns P Power Dissipation (T = 25°C) 72 W D C - Derate above 25°C 0.57 W/°C T , T Operating and Storage Temperature Range -55 to +150 °C J STG Maximum lead temperature for soldering purposes, T 300 °C L 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Typ Max Units R Thermal Resistance, Junction-to-Case -- 1.74 °C/W θJC R Thermal Resistance, Junction-to-Ambient * -- 40 °C/W θJA R Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W θJA ©2003 Rev. A, August 2003
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