IC Phoenix
 
Home ›  FF11 > FDZ204P,P-Channel 2.5V Specified PowerTrench BGA MOSFET
FDZ204P Fast Delivery,Good Price
Part Number:
If you need More Quantity or Better Price,Welcom Any inquiry.
We available via phone +865332716050 Email
Partno Mfg Dc Qty AvailableDescript
FDZ204PFAIRCHILDN/a3000avaiP-Channel 2.5V Specified PowerTrench BGA MOSFET


FDZ204P ,P-Channel 2.5V Specified PowerTrench BGA MOSFETFeatures Combining Fairchild’s advanced 2.5V specified • –4.5 A, –20 V. R = 45 mΩ @ V = –4.5 V DS(O ..
FDZ206P ,P-Channel 2.5V Specified PowerTrench BGA MOSFETFeatures Combining Fairchild’s advanced 2.5V specified • –13 A, –20 V. R = 9.5 mΩ @ V = –4.5 V DS(O ..
FDZ208P ,P-Channel 30 Volt PowerTrench BGA MOSFETApplications • 3.5 x 4 mm footprint • Battery management • High power and current handling capabil ..
FDZ209N ,60V N-Channel PowerTrench BGA MOSFETApplications · Outstanding thermal transfer characteristics: 4 times better than SSOT-6 · Solenoid ..
FDZ2554P ,Dual P-Channel 2.5V Specified PowerTrench BGA MOSFETApplications• Outstanding thermal transfer characteristics:• Battery managementsignificantly better ..
FDZ2554P ,Dual P-Channel 2.5V Specified PowerTrench BGA MOSFETFeaturesCombining Fairchild’s advanced 2.5V specified• –6.5 A, –20 V. R = 28 mΩ @ V = –4.5 VDS(ON) ..
FS3KM-9 , Nch POWER MOSFET HIGH-SPEED SWITCHING USE
FS3KMA-5A , Nch POWER MOSFET HIGH-SPEED SWITCHING USE
FS3UM-18A , Nch POWER MOSFET HIGH-SPEED SWITCHING USE
FS401LF , PC to TV Video Scan Converters
FS40SM-5 , Nch POWER MOSFET HIGH-SPEED SWITCHING USE
FS40SM-5 , Nch POWER MOSFET HIGH-SPEED SWITCHING USE


FDZ204P
P-Channel 2.5V Specified PowerTrench BGA MOSFET
FDZ204P F204P July 2002 FDZ204P     P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified • –4.5 A, –20 V. R = 45 mΩ @ V = –4.5 V DS(ON) GS PowerTrench process with state of the art BGA R = 75 mΩ @ V = –2.5 V DS(ON) GS packaging, the FDZ204P minimizes both PCB space and R . This BGA MOSFET embodies a DS(ON) 2 • Occupies only 3.7 mm of PCB area. breakthrough in packaging technology which enables Less than 40% of the area of a SSOT-6 the device to combine excellent thermal transfer characteristics, high current handling capability, ultra- • Ultra-thin package: less than 0.70 mm height when low profile packaging, low gate charge, and low R . DS(ON) mounted to PCB Applications • Ultra-low Q x R figure-of-merit. g DS(ON) • Battery management • High power and current handling capability. • Load switch • Battery protection S D D D Pin 1 S S S G G S S Bottom D Top o Absolute Maximum Ratings T =25 C unless otherwise noted A Symbol Parameter Ratings Units V Drain-Source Voltage –20 V DSS V Gate-Source Voltage V GSS ±12 I Drain Current – Continuous (Note 1a) –4.5 A D – Pulsed –20 P Power Dissipation (Steady State) (Note 1a) 1.8 W D T , T Operating and Storage Junction Temperature Range –55 to +150 J STG °C Thermal Characteristics Thermal Resistance, Junction-to-Ambient (Note 1a) 67 R °C/W θJA Thermal Resistance, Junction-to-Ball (Note 1) 11 RθJB °C/W (Note 1) 1 R Thermal Resistance, Junction-to-Case °C/W θJC Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 204P FDZ204P 7’’ 8mm 3000 units 2002 FDZ204P Rev. D(W)
ic,good price


TEL:86-533-2716050      FAX:86-533-2716790
   

©2020 IC PHOENIX CO.,LIMITED