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FDMS7558SFAIRCHILDN/a1535avai


FDMS7558S Applications„ MSL1 robust package design„ Synchronous Rectifier for Synchronous Buck Converters„ 10 ..
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FDMS7558S

® FDMS7558S N-Channel PowerTrench SyncFET December 2009 FDMS7558S ® TM N-Channel PowerTrench SyncFET 25 V, 49 A, 1.25 mΩ Features General Description The FDMS7558S has been designed to minimize losses in „ Max r = 1.25 mΩ at V = 10 V, I = 32 A DS(on) GS D power conversion application. Advancements in both silicon and „ Max r = 1.75 mΩ at V = 4.5 V, I = 28 A DS(on) GS D package technologies have been combined to offer the lowest r while maintaining excellent switching performance. This DS(on) „ Advanced Package and Silicon combination for low r DS(on) device has the added benefit of an efficient monolithic Schottky and high efficiency body diode. „ SyncFET Schottky Body Diode Applications „ MSL1 robust package design „ Synchronous Rectifier for Synchronous Buck Converters „ 100% UIL tested „ Notebook „ RoHS Compliant „ Server „ Telecom „ High Efficiency DC-DC Switch Mode Power Supplies Bottom Top Pin 1 D 5 4 G S S S D G 6 3 S D S 7 2 D S D 8 1 D D D Power 56 MOSFET Maximum Ratings T = 25 °C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 25 V DS V Gate to Source Voltage (Note 4) ±20 V GS Drain Current -Continuous (Package limited) T = 25 °C 49 C -Continuous (Silicon limited) T = 25 °C 199 C I A D -Continuous T = 25 °C (Note 1a) 32 A -Pulsed 180 E Single Pulse Avalanche Energy (Note 3) 288 mJ AS Power Dissipation T = 25 °C 89 C P W D Power Dissipation T = 25 °C (Note 1a) 2.5 A T , T Operating and Storage Junction Temperature Range -55 to +150 °C J STG Thermal Characteristics R Thermal Resistance, Junction to Case 1.4 θJC °C/W R Thermal Resistance, Junction to Ambient (Note 1a) 50 θJA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDMS7558S FDMS7558S Power 56 13 ’’ 12 mm 3000 units ©2009 1 FDMS7558S Rev.C
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