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Partno Mfg Dc Qty AvailableDescript
FDMS0310SFAIRCHILN/a300avai
FDMS0310SFSCN/a500avai


FDMS0310S Applications„ MSL1 robust package design„ 100% UIL tested„ Synchronous Rectifier for DC/DC Converte ..
FDMS0310S General DescriptionThe FDMS0310S has been designed to minimize losses in „ Max r = 4.0 mΩ at V = 10 ..
FDMS0312AS Applications„ MSL1 robust package design„ Synchronous Rectifier for DC/DC Converters„ 100% UIL test ..
FDMS0312S General DescriptionThe FDMS0312S has been designed to minimize losses in „ Max r = 4.9 m: at V = 10 ..
FDMS0312S Applications„ MSL1 robust package design„ 100% UIL tested„ Synchronous Rectifier for DC/DC Converte ..
FDMS2572 ,150V N-Channel UltraFET Trench MOSFETGeneral Description„ Max r = 47mΩ at V = 10V, I = 4.5AUItraFET devices combine characteristics that ..
FP75R12KE3 , Elektrische Eigenschaften / Electrical properties
FP75R12KT3 , EconoPIM3 module with fast trench/fieldstop IGBT3 and EmCon High Efficiency diode
FP75R12KT4 , EconoPIM3 module with trench/fieldstop IGBT4 and EmCon4 diode
FP75R12KT4_B15 , EconoPIM™3 module with trench/fieldstop IGBT4 and Emitter Controlled 4 diode
FP7G150US60 ,Transfer Molded Type IGBT ModuleFeatures• Short Circuit rated 10us @Tc=100C, Vge=15V• High Speed Switching• Low Saturation Voltage ..
FP7G50US60 ,Transfer Molded Type IGBT ModuleFeatures• Short Circuit rated 10us @Tc=100°C, Vge=15V• High Speed Switching• Low Saturation Voltage ..


FDMS0310S

® TM FDMS0310S N-Channel PowerTrench SyncFET September 2009 FDMS0310S ® TM N-Channel PowerTrench SyncFET 30 V, 42 A, 4 mΩ Features General Description The FDMS0310S has been designed to minimize losses in „ Max r = 4.0 mΩ at V = 10 V, I = 18 A DS(on) GS D power conversion application. Advancements in both silicon and „ Max r = 5.2 mΩ at V = 4.5 V, I = 14 A DS(on) GS D package technologies have been combined to offer the lowest r while maintaining excellent switching performance. This „ Advanced Package and Silicon combination for low r DS(on) DS(on) device has the added benefit of an efficient monolithic Schottky and high efficiency body diode. „ SyncFET Schottky Body Diode Applications „ MSL1 robust package design „ 100% UIL tested „ Synchronous Rectifier for DC/DC Converters „ RoHS Compliant „ Notebook Vcore/ GPU low side switch „ Networking Point of Load low side switch „ Desktop Bottom Top Pin 1 D G S 5 4 S S D G S 6 3 D S 7 2 D S D 8 1 D D D Power 56 MOSFET Maximum Ratings T = 25 °C unless otherwise noted A Symbol Parameter Ratings Units V Drain to Source Voltage 30 V DS V Gate to Source Voltage (Note 4) ±20 V GS Drain Current -Continuous (Package limited) T = 25 °C 42 C -Continuous (Silicon limited) T = 25 °C 83 C I A D -Continuous T = 25 °C (Note 1a) 19 A -Pulsed 90 E Single Pulse Avalanche Energy (Note 3) 60 mJ AS Power Dissipation T = 25 °C 46 C P W D Power Dissipation T = 25 °C (Note 1a) 2.5 A T , T Operating and Storage Junction Temperature Range -55 to +150 °C J STG Thermal Characteristics R Thermal Resistance, Junction to Case 2.7 θJC °C/W R Thermal Resistance, Junction to Ambient (Note 1a) 50 θJA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDMS0310S FDMS0310S Power 56 13 ’’ 12 mm 3000 units 1 ©2009 FDMS0310S Rev.C
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