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FDFMA2P853FSCN/a2901avai-20V Integrated P-Channel PowerTrench?MOSFET and Schottky Diode


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FDFMA2P853
-20V Integrated P-Channel PowerTrench?MOSFET and Schottky Diode
FDFMA2P853 Integrated P-Channel PowerTrench
MOSFET and Schottky Diode
FDFMA2P853
Integrated P-Channel PowerTrench® MOSFET and Schottky Diode
General Description Features

This device is designed specifically as a single package
solution for the battery charge switch in cellular handset
and other ultra-portable applications. It features a MOSFET
with low on-state resistance and an independently
connected low forward voltage schottky diode for minimum
conduction losses.
The MicroFET 2x2 package offers exceptional thermal
perfo rmance for it's physica
mode applications.
MOSFET:
-3.0 A, -20V. RDS(ON) = 120 m: @ VGS = -4.5 V
RDS(ON) = 160 m: @ VGS = -2.5 V
RDS(ON) = 240 m: @ VGS = -1.8 V
Schottky:

VF < 0.46 V @ 500 mA Low Profile - 0.8 mm maximun - in the new package
MicroFET 2x2 mm RoHS Compliant
Absolute Maximum Ratings
TA= 25°C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units

VDSS MOSFET Drain-Source Voltage -20 V
VGSS MOSFET Gate-Source Voltage r8V Drain Current -Continuous (Note 1a)
-Pulsed
-3.0 A-6
VRRM Schottky Repetitive Peak Reverse voltage 30V Schottky Average Forward Current (Note 1a) 1 A Power dissipation for Single Operation (Note 1a)
Power dissipation for Single Operation (Note 1b)
1.4 W0.7
TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 oC
RTJA Thermal Resistance, Junction-to-Ambient (Note 1a) 86 C/WRTJA Thermal Resistance, Junction-to-Ambient (Note 1b) 173
RTJA Thermal Resistance, Junction-to-Ambient (Note 1c) 86
RTJA Thermal Resistance, Junction-to-Ambient (Note 1d) 140
Device Marking Device Reel Size Tape Width Quantity
September 2008
September 2008
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