FDD8874 ,30V N-Channel PowerTrench MOSFETFDD8874 / FDU8874November 2004FDD8874 / FDU8874®N-Channel PowerTrench MOSFET30V, 116A, 5.1mΩGeneral ..
FDD8876 ,30V N-Channel PowerTrench MOSFETFeaturesThis N-Channel MOSFET has been designed specifically to r = 8.2mΩ , V = 10V, I = 35ADS(ON) ..
FDD8876 ,30V N-Channel PowerTrench MOSFETApplications High power and current handling capability• DC/DC convertersDDGGI-PAKS(TO-251AA)D-PAK ..
FDD8876 ,30V N-Channel PowerTrench MOSFETApplications High power and current handling capability• DC/DC convertersDDGGI-PAKS(TO-251AA)D-PAK ..
FDD8878 ,30V N-Channel PowerTrench MOSFETApplications
FDD8874-FDU8874
30V N-Channel PowerTrench MOSFET
FDD8874 / FDU8874 November 2004 FDD8874 / FDU8874 ® N-Channel PowerTrench MOSFET 30V, 116A, 5.1mΩ General Description Features This N-Channel MOSFET has been designed specifically to r = 5.1mΩ, V = 10V, I = 35A DS(ON) GS D improve the overall efficiency of DC/DC converters using r = 6.4mΩ, V = 4.5V, I = 35A either synchronous or conventional switching PWM DS(ON) GS D controllers. It has been optimized for low gate charge, low High performance trench technology for extremely low r and fast switching speed. DS(ON) r DS(ON) Low gate charge Applications High power and current handling capability • DC/DC converters D D G G I-PAK S (TO-251AA) D-PAK TO-252 S G DS (TO-252) MOSFET Maximum Ratings T = 25°C unless otherwise noted C Symbol Parameter Ratings Units V Drain to Source Voltage 30 V DSS V Gate to Source Voltage ±20 V GS Drain Current o 116 A Continuous (T = 25 C, V = 10V) (Note 1) C GS o I Continuous (T = 25 C, V = 4.5V) (Note 1) 103 A D C GS o o Continuous (T = 25 C, V = 10V, with R = 52 C/W) 18 A amb GS θJA Pulsed Figure 4 A E Single Pulse Avalanche Energy (Note 2) 240 mJ AS Power dissipation 110 W P D o o Derate above 25C0.73W/ C o T , T Operating and Storage Temperature -55 to 175 C J STG Thermal Characteristics o R Thermal Resistance Junction to Case TO-252, TO-251 1.36 C/W θJC o R Thermal Resistance Junction to Ambient TO-252, TO-251 100 C/W θJA 2 o R Thermal Resistance Junction to Ambient TO-252, 1in copper pad area 52 C/W θJA ©2004 FDD8874 / FDU8874 Rev. B1
