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ESDA14V2-4BF2
QUAD BIDIRECTIONAL TRANSIL ARRAY FOR ESD PROTECTION
April 2008 Rev 4 1/8
ESDA14V2-4BF2Quad bidirectional T ransil™ array for ESD protection
Features 4 Bidirectional Transil functions ESD Protection: IEC 61000-4-2 level 4 Stand off voltage: 12 V Min. Low leakage current < 1 µA 50 W Peak pulse power (8/20 µs)
Benefits High ESD protection level High integration Suitable for high density boards
Complies with the following standards IEC 61000-4-2 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883F- Method 3015-7: class3 25 kV (human body model)
ApplicationsWhere transient overvoltage protection in ESD
sensitive equipment is required, such as : Computers Printers Communication systems and cellular phones Video equipment
DescriptionThe ESDA14V2-4BF2 is a monolithic array
designed to protect up to 4 lines (bidirectional)
against ESD transients.
This device is particularly adapted to the
protection of symmetrical signals.
The device is ideal for situations where board
space saving is requested.
Figure 1. Device configuration
Figure 2. Pin configuration (bump side)
TM: Transil is a trademark of STMicroelectronics.
Characteristics ESDA14V2-4BF22/8
1 Characteristics
Table 1. Absolute ratings (limiting values)
Table 2. Electrical characteristics (Tamb = 25 °C) Square pulse, Ipp = 3 A, tp = 2.5 µs. Δ VBR = αT* (Tamb -25 °C) * VBR (25 °C)
ESDA14V2-4BF2 Characteristics 3/8
Figure 3. Clamping voltage versus peak
pulse current (Tj initial = 25 °C)
(Rectangular waveform, tp = 2.5 µs)
Figure 4. Capacitance versus reverse applied
voltage (typical values)
Figure 5. Relative variation of leakage
current versus junction
temperature (typical values)
Figure 6. ESD response to IEC 61000-4-2
(+15 kV air discharge)
Figure 7. ESD response to IEC 61000-4-2
(-15 kV air discharge)
Figure 8. Analog crosstalk
Application information ESDA14V2-4BF24/8
Figure 9. Digital crosstalk
2 Application information
Figure 10. Application example
Figure 11. Aplac model
ESDA14V2-4BF2 Ordering information scheme 5/8
Ordering information scheme
Figure 12. Ordering information scheme
4 Package informationIn order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
.
Figure 13. Flip Chip package mechanical data
Package information ESDA14V2-4BF26/8
Figure 16. Flip Chip tape and reel specification
Figure 14. Foot print recommendations Figure 15. Marking
