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DS1315EN-33 |DS1315EN33DALLASN/a89avaiPhantom Time Chip


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DS1315EN-33
Phantom Time Chip
FEATURES Real time clock keeps track of hundredths of
seconds, seconds, minutes, hours, days, date
of the month, months, and years Adjusts for months with fewer than 31 days§ Automatic leap year correction valid up to
2100 No address space required to communicate
with RTC§ Provides nonvolatile controller functions for
battery backup of SRAM Supports redundant battery attachment for
high–reliability applications Full ±10% VCC operating range§ +3.3 volt or +5 volt operation Industrial (–45°C to +85°C) operating
temperature ranges available Drop in replacement for DS1215
ORDERING INFORMATION

DS1315XX-XX
33-3.3 volt operation
5-5 volt operation
blank-commercial temp rangeN-industrial temp range
blank-16-pin DIP
S-16-pin SOIC
E-20-pin TSSOP
PIN ASSIGNMENT
Phantom Time Chip

VCC1
VCC0
DS1315
PIN DESCRIPTION

X1, X2- 32.768 kHz Crystal Connection- Write Enable
BAT1- Battery 1 Input
GND- Ground- Data Input- Data Output
ROM/- ROM/RAM Mode Select
CEO- Chip Enable Output
CEI- Chip Enable Input- Output Enable
RST- Reset
BAT2- Battery 2 Input
VCC0- Switched Supply Output
VCC1- Power Supply Input
DESCRIPTION

The DS1315 Phantom Time Chip is a combination of a CMOS timekeeper and a nonvolatile memory
controller. In the absence of power, an external battery maintains the timekeeping operation and provides
power for a CMOS static RAM. The watch keeps track of hundredths of seconds, seconds, minutes,
hours, day, date, month, and year information. The last day of the month is automatically adjusted for
months with less than 31 days, including leap year correction. The watch operates in one of two formats:a 12-hour mode with an AM/PM indicator or a 24-hour mode. The nonvolatile controller supplies all the
necessary support circuitry to convert a CMOS RAM to a nonvolatile memory. The DS1315 can be
interfaced with either RAM or ROM without leaving gaps in memory.
OPERATION

The block diagram of Figure 1 illustrates the main elements of the Time Chip. The following paragraphsdescribe the signals and functions.
DS1315
TIMING BLOCK DIAGRAM Figure 1

Communication with the Time Chip is established by pattern recognition of a serial bit stream of 64 bits
which must be matched by executing 64 consecutive write cycles containing the proper data on data in(D). All accesses which occur prior to recognition of the 64-bit pattern are directed to memory via the
chip enable output pin (CEO).
After recognition is established, the next 64 read or write cycles either extract or update data in the Time
Chip and CEO remains high during this time, disabling the connected memory.
Data transfer to and from the timekeeping function is accomplished with a serial bit stream under control
of chip enable input (CEI), output enable (OE), and write enable (WE). Initially, a read cycle using the
CEI and OE control of the Time Chip starts the pattern recognition sequence by moving pointer to the
first bit of the 64-bit comparison register. Next, 64 consecutive write cycles are executed using the CEI
and WE control of the Time Chip. These 64 write cycles are used only to gain access to the Time Chip.
When the first write cycle is executed, it is compared to bit 1 of the 64-bit comparison register. If a match
is found, the pointer increments to the next location of the comparison register and awaits the next write
cycle. If a match is not found, the pointer does not advance and all subsequent write cycles are ignored. If
a read cycle occurs at any time during pattern recognition, the present sequence is aborted and thecomparison register pointer is reset. Pattern recognition continues for a total of 64 write cycles as
described above until all the bits in the comparison register have been matched. (This bit pattern is shown
DS1315
outside the memory block can be interleaved with CEI cycles without interrupting the pattern recognition
sequence or data transfer sequence to the Time Chip.
A standard 32.768 kHz quartz crystal can be directly connected to the DS1315 via pins 1 and 2 (X1, X2).
The crystal selected for use should have a specified load capacitance (CL) of 6 pF. For more information
on crystal selection and crystal layout considerations, please consult Application Note 58, “CrystalConsiderations with Dallas Real Time Clocks.”
TIME CHIP COMPARISON REGISTER DEFINITION Figure 2
NOTE:

The pattern recognition in Hex is C5, 3A, A3, 5C, C5, 3A, A3, 5C. The odds of this pattern being
accidentally duplicated and causing inadvertent entry to the Phantom Time Chip are less than 1 in 1019.
DS1315
NONVOLATILE CONTROLLER OPERATION

The operation of the nonvolatile controller circuits within the Time Chip is determined by the level of the
ROM/
and performs the circuit functions required to make CMOS RAM and the timekeeping function
nonvolatile. A switch is provided to direct power from the battery inputs or VCCI to VCCO with amaximum voltage drop of 0.3 volts. The VCCO output pin is used to supply uninterrupted power to CMOS
SRAM. The DS1315 also performs redundant battery control for high reliability. On power-fail, the
battery with the highest voltage is automatically switched to VCCO. If only one battery is used in the
system, the unused battery input should be connected to ground.
The DS1315 safeguards the Time Chip and RAM data by power-fail detection and write protection.
Power-fail detection occurs when VCCI falls below VPF which is set by an internal bandgap reference. The
DS1315 constantly monitors the VCCI supply pin. When VCCI is less than VPF, power-fail circuitry forces
the chip enable output (CEO) to VCCI or VBAT-0.2 volts for external RAM write protection. During
nominal supply conditions, CEO will track CEI with a propagation delay. Internally, the DS1315 aborts
any data transfer in progress without changing any of the Time Chip registers and prevents future access
until VCCI exceeds VPF. A typical RAM/Time Chip interface is illustrated in Figure 3.
When the ROM/
read-only device that retains data in the absence of power, battery backup and write protection is not
required. As a result, the chip enable logic will force CEO low when power fails. However, the Time
Chip does retain the same internal nonvolatility and write protection as described in the RAM mode. Atypical ROM/Time Chip interface is illustrated in Figure 4.
DS1315 TO RAM/TIME CHIP INTERFACE Figure 3
DS1315
ROM/TIME CHIP INTERFACE Figure 4
TIME CHIP REGISTER INFORMATION

Time Chip information is contained in eight registers of 8 bits, each of which is sequentially accessed 1
bit at a time after the 64-bit pattern recognition sequence has been completed. When updating the Time
Chip registers, each must be handled in groups of 8 bits. Writing and reading individual bits within aregister could produce erroneous results. These read/write registers are defined in Figure 5.
Data contained in the Time Chip registers is in binary coded decimal format (BCD). Reading and writing
the registers is always accomplished by stepping though all eight registers, starting with bit 0 of register 0
and ending with bit 7 of register 7.
AM–PM/12/24 MODE

Bit 7 of the hours register is defined as the 12- or 24-hour mode select bit. When high, the 12-hour mode
is selected. In the 12-hour mode, bit 5 is the AM/PM bit with logic high being PM. In the 24-hour mode,
bit 5 is the second 10-hour bit (20-23 hours).
OSCILLATOR AND RESET BITS

Bits 4 and 5 of the day register are used to control the reset and oscillator functions. Bit 4 controls the
reset pin input. When the reset bit is set to logic 1, the reset input pin is ignored. When the reset bit is setto logic 0, a low input on the reset pin will cause the Time Chip to abort data transfer without changing
data in the timekeeping registers. Reset operates independently of all other in-puts. Bit 5 controls the
oscillator. When set to logic 0, the oscillator turns on and the real time clock/calendar begins to
increment.
ZERO BITS
DS1315
TIME CHIP REGISTER DEFINITION Figure 5
DS1315
ABSOLUTE MAXIMUM RATINGS*

Voltage on any Pin Relative to Ground-0.3V to +7.0V
Operating Temperature, commercial range0°C to 70°C
Operating Temperature, industrial range-45°C to +85°C
Storage Temperature-55°C to +125°C
Soldering Temperature260°C for 10 seconds
* This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
(0°C to 70°C)
DC OPERATING ELECTRICAL CHARACTERISTICS

(0°C to 70°C; VCC = 5.0 ± 10%)
DS1315
DC POWER DOWN ELECTRICAL CHARACTERISTICS

(0°C to 70°C; VCC < 4.5V)
AC ELECTRICAL OPERATING CHARACTERISTICS
ROM/RAM
(0°C to 70°C; VCC = 5.0 ± 10%)
DS1315
AC ELECTRICAL OPERATING CHARACTERISTICS
ROM/RAM
(0°C to 70°C; VCC = 5.0 ± 10%)
DC OPERATING ELECTRICAL CHARACTERISTICS

(0°C to 70°C; VCC = 3.3 ± 10%)
DS1315
DC POWER DOWN ELECTRICAL CHARACTERISTICS

(0°C to 70°C; VCC < 2.97V)
AC ELECTRICAL OPERATING CHARACTERISTICS
ROM/RAM
(0°C to 70°C; VCC = 3.3 ± 10%)
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