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DAC10FX-DAC10GP-DAC10GS-DAC10GX Fast Delivery,Good Price
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DAC10FXPMIN/a8avai10-Bit High Speed Multiplying D/A Converter Universal Digital Logic Interface
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DAC10FX-DAC10GP-DAC10GS-DAC10GX
10-Bit High Speed Multiplying D/A Converter Universal Digital Logic Interface
REV.D
10-Bit High Speed Multiplying D/A Converter
(Universal Digital Logic Interface)
FEATURES
Fast Settling:85 ns
Low Full-Scale Drift:10 ppm/8C
Nonlinearity to 0.05% Max Over Temperature Range
Complementary Current Outputs:0mA to 4mA␣
Wide Range Multiplying Capability:1MHz Bandwidth
Wide Power Supply Range: +5, –7.5 Min to 618V Max
Direct Interface to TTL, CMOS, ECL, PMOS, NMOS
Availability in Die Form␣
GENERAL DESCRIPTION

The DAC10 series of 10-bit monolithic multiplying digital-to-
analog converters provide high speed performance and full-scale
accuracy.
Advanced circuit design achieves 85ns settling times with very
low “glitch” energy and low power consumption. Direct inter-
face to all popular logic families with full noise immunity is
provided by the high swing, adjustable threshold logic inputs.
SIMPLIFIED SCHEMATICIOUT
IOUTVLC
MSBB2B3B4B5B6B7B8B9B10
LSB
VREF (+)
VREF (–)
COMPV–

All DAC10 series models guarantee full 10-bit monotonicity,
and nonlinearities as tight as +0.05% over the entire operating
temperature range are available. Device performance is essen-
tially unchanged over the ±18 V power supply range, withmW power consumption attainable at lower supplies.
A highly stable, unique trim method is used, which selectively
shorts Zener diodes, to provide 1/2 LSB full-scale accuracy
without the need for laser trimming.
Single-chip reliability, coupled with low cost and outstanding
flexibility, make the DAC10 device an ideal building block for
A/D converters, Data Acquisition systems, CRT displays, pro-
grammable test equipment and other applications where low
power consumption, input/output versatility and long-term
stability are required.
*Protected by Patent Nos. 4,055,770, 4,056,740 and 4,092,639.
DAC10–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
(@ VS = 615V; IREF = 2mA; 08C ≤ TA ≤ +708C for DAC10F and G, unless otherwise noted.
Output characteristics apply to both IOUT and IOUT.)
(@ VS = 615V; IREF = 2mA; TA = +258C, unless otherwise noted. Output characteristics
apply to both IOUT and IOUT.)
DAC10
WAFER TEST LIMITS

NOTE: Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not
guaranteed for standard produce dice.
TYPICAL ELECTRICAL CHARACTERISTICS

GAIN TEMPERATURE
(@ VS = 615 V, IREF = 2 mA, TA = +258C, unless otherwise noted. Output characteristics refer to both
IOUT and IOUT).
(@ VS = 615 V, IREF = 2 mA, unless otherwise noted. Output characteristics
refer to both IOUT and IOUT).
DICE CHARACTERISTICS
DIE SIZE 0.091 3 0.087 inch, 7,917 sq. mils
(2.311 3 2.210 mm, 5.107 sq. mm)
DAC10
ABSOLUTE MAXIMUM RATINGS1

Operating Temperature
DAC10FX, GX, GS, GP . . . . . . . . . . . . . . . .0°C to +70°C
Junction Temperature (TJ) . . . . . . . . . . . . . –65°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . V– to V– plus 36 V
VLC␣ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V– to V+
Analog Current Outputs . . . . . . . . . . . . . . . . +18 V to –18 V
Reference Inputs (V16 to V17) . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage (V16 to V17) . . . . ±18 V
Reference Input Current (I16) . . . . . . . . . . . . . . . . . . 2.5 mA
NOTESAbsolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.θJA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for Cerdip packages.
ORDERING GUIDE
PIN CONNECTIONS
18-Lead Hermetic DIP
18-Lead Plastic DIP
18-Lead SOIC
VLC
(MSB) B1
COMP
VREF(–)
VREF(+)
B10 (LSB)
CAUTION
BASIC CONNECTIONS
0mA
1.0mA
2.0mA
IOUT
IOUT
(0000000000)(11111111111)

Figure 1.True and Complementary
Output Operations
V+, POSITIVE POWER SUPPLY – VDC
POWER SUPPLY CURRENT – mA204681012141618

Figure 4.Power Supply Current
vs. V+B3
B10
VLC
IFR =+VREF
RREF
31023
10242
3
IO + IO = IFR FOR ALL
LOGIC STATES
+VREF
RREF
MSBLSB
R15 = RREF
CC = 0.01mF
VLC = 0V (GROUND)

Figure 7.Basic Positive Reference Operation
OUTPUT VOLTAGE – Volts
OUTPUT CURRENT – mA
1.6

Figure 2.Output Current vs. Output
Voltage (Output Voltage Compliance)

POWER SUPPLY CURRENT – mA–20–4–8–12–16
V–, NEGATIVE POWER SUPPLY – VDC

Figure 5.Power Supply Current
vs. V–
TEMPERATURE – 8C
OUTPUT VOLTAGE – Volts
+28
–50+50+100+150
+24
+20
+16
+12

Figure 3.Output Voltage Compliance
vs. Temperature
TEMPERATURE – 8C
POWER SUPPLY CURRENT – mA
–500+50+100+150

Figure 6.Power Supply Current vs.
Temperature
Figure 8.Accommodating Bipolar References
DAC10
Figure 13.Offset Binary Operation
Figure 12.Basic Bipolar Output Operation
Figure 11.Basic Unipolar Negative Operation
Figure 9.Basic Negative Reference OperationFigure 10.Recommended Full-Scale Adjustment Circuit
RREF
R17IO
IFS–VREF
RREF2
3
–VREF
NOTE: RREF SETS IFS; R17 IS FOR BIAS
CURRENT CANCELLATIONB2B3B4B5B6B7B8B9B10
MSBLSBIREF =
2.000mAB2B3B4B5B6B7B8B9B10111111110000001000000000111111110000001000000000
FULL RANGE
HALF-SCALE +LSB
HALF-SCALE
HALF-SCALE –LSB
HALF-SCALE +LSB
ZERO SCALE +LSB
IOmA
IOmA
VREF
+10V
LOW T.C.
4.5kV
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