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BZA856AL-BZA862AL-BZA868AL
Quadruple ESD transient voltage suppressor
NXP Semiconductors Product data sheet
Quadruple ESD transient voltage
suppressor BZA800AL series
FEATURES ESD rating >8 kV contact discharge, according to
IEC1000-4-2 SOT353 (SC-88A) surface mount package Common anode configuration.
APPLICATIONS Computers and peripherals Audio and video equipment Communication systems.
DESCRIPTIONMonolithic transient voltage suppressor diode in a five lead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
MARKING
LIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC 60134).
Notes DC working current limited by Ptot(max). Device mounted on standard printed-circuit board.
NXP Semiconductors Product data sheet
Quadruple ESD transient voltage
suppressor BZA800AL series
THERMAL CHARACTERISTICS
Note Solder point of common anode (pin 2).
ELECTRICAL CHARACTERISTICSTj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
Quadruple ESD transient voltage
suppressor BZA800AL series
NXP Semiconductors Product data sheet
Quadruple ESD transient voltage
suppressor BZA800AL series
NXP Semiconductors Product data sheet
Quadruple ESD transient voltage
suppressor BZA800AL series
APPLICATION INFORMATION
Typical common anode applicationA quadruple transient suppressor in a SOT353 (SC88A) package makes it possible to protect four separate lines using
only one package. A simplified example is shown in Fig 7.
Device placement and printed-circuit board layoutCircuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA800AL is
determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: Place the suppression element close to the input terminals or connectors Keep parallel signal paths to a minimum Avoid running protection conductors in parallel with unprotected conductors Minimize all printed-circuit board loop areas including power and ground loops Minimize the length of the transient return path to ground Avoid using shared transient return paths to a common ground point.
