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BYV26EGP-BYV26EGP. Fast Delivery,Good Price
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BYV26EGPVISN/a20000avaiGlass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0A
BYV26EGPTSCN/a3avaiGlass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0A
BYV26EGP. |BYV26EGPTSCN/a181avaiGlass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0A


BYV26EGP ,Glass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0A07-Mar-02 1Patented*BYV26DGP and BYV26EGPVishay Semiconductorsformerly General SemiconductorRatings ..
BYV26EGP ,Glass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0AThermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.Parameter Sy ..
BYV26EGP. ,Glass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0AFeaturesDia.• High temperature metallurgically bonded construction• Plastic package has Underwriter ..
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BYV26EGP-BYV26EGP.
Glass Passivated Ultrafast Rectifier, Reverse Voltage 800 to 1000V, Forward Current 1.0A
BYV26DGP and BYV26EGP
Vishay Semiconductors
formerly General Semiconductor
New Product
Reverse Voltage
800 to 1000V
Forward Current 1.0A
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Notes:
(1) Peak reverse energy measured at IR = 400mA, TJ = TJ max. on inductive load, t = 20μs
Features

• High temperature metallurgically bonded construction
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0.
• Cavity-free glass passivated junction
• Ultrafast recovery time for high efficiency
• Low forward voltage, high current capability
• Capable of meeting environmental standards of
MIL-S-19500
• Low leakage current • High surge current capability
• Specified reverse surge capability
• High temperature soldering guaranteed:350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case:
JEDEC DO-204AC, molded plastic over glass body
Terminals:
Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.015 oz., 0.4 g
*Glass-plastic encapsulation technique is covered by
Patent No.3,996,602 and brazed-lead assembly by Patent No.
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