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BYT30G-400
HIGH EFFICIENCY FAST RECOVERY DIODES
BYT30G-400October 1999 - Ed: 3A
HIGH EFFICIENCY FAST RECOVERY DIODES
MAIN PRODUCT CHARACTERISTICSVERY LOW REVERSE RECOVERY TIME
VERY LOW SWITCHING LOSSES
LOW NOISE TURN-OFF SWITCHING
SMD PACKAGE
FEATURES AND BENEFITSSingle rectifier suited for freewheeling in convert-
ers and motor control circuits.
Packaged in D2 PAK, this surface mount device is
intended for use in high frequency inverters, free
wheeling and polarity protection applications.
DESCRIPTION
ABSOLUTE MAXIMUM RATINGS1/5
THERMAL RESISTANCEPulse test : * tp = 5 ms, δ< 2 %
** tp = 380 μs, δ < 2 %
To evaluate the conduction losses use the following equation :
P = 1.1 x IF(AV) + 0.0095 IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
RECOVERY CHARACTERISTICS
TURN-OFF SWITCHING CHARACTERISTICS
PIN OUT configuration in D2
PAK:
BYT30G-4002/5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
IM(A)
Fig.2 : Peak current versus form factor.
0.1 1 10 100
VFM(V)
Fig.3 : Forward voltage drop versus forward cur-rent (maximum values).
0.001 0.01 0.1 10.1
Fig.4 : Relative variation of thermal impedance
junction to case versus pulse duration.
5 10 15 20 25 30 35 40 F(av)(W)
Fig.1 : Average forward power dissipation versusaverage forward current.
20 40 60 80 100 120 140 160
F(av)(A)I
Fig.6 : Average current versus ambient tempera-ture. (δ: 0.5)
0.001 0.01 0.1 1
IM(A)
Fig.5 : Non repetitive surge peak forward currentversus overload duration.
BYT30G-4003/5
Fig.10 : Peak forward voltage versus dIF/dt.Fig.9 : Peak reverse current versus dIF/dt.
Fig.8 : Forward recovery times versus dIF/dt.Fig.7 : Reverse recovery charge versus dIF/dt.
Fig.11: Dynamic parameters versus junction tem-perature.
BYT30G-4004/5
PACKAGE MECHANICAL DATA2 PAK (Plastic)
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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http://
FOOT PRINT (in millimeters)
BYT30G-4005/5
:
www.ic-phoenix.com
.
