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BLC8G27LS-160AV |BLC8G27LS160AVNXPN/a326avaiPower LDMOS transistor


BLC8G27LS-160AV ,Power LDMOS transistorapplications in the 2496 MHz to 2690 MHz frequency rangeBLC8G27LS-160AVNXP SemiconductorsPower LDMO ..
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BLC8G27LS-160AV
Power LDMOS transistor
1. Product profile
1.1 General description

160 W LDMOS packaged asymmetrical Doherty power transistor for base station
applications at frequencies from 2496 MHz to 2690 MHz.
[1] Test signal: 3GPP test model 1; 1 to 64 DPCH; PAR=7.2 dB at 0.01 % probability on CCDF.
1.2 Features and benefits
Excellent ruggedness High efficiency Low Rth providing excellent thermal stability Decoupling leads to enable improved video bandwidth Lower output capacitance for improved performance in Doherty applications Designed for low memory effects providing excellent pre-distortability Internally matched for ease of use Integrated ESD protection Compliant to Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC
1.3 Applications
RF power amplifier for W-CDMA base stations and multi carrier applications in the
2496 MHz to 2690 MHz frequency range
BLC8G27LS-160A V
Power LDMOS transistor
Rev. 1 — 23 May 2013 Objective data sheet
Table 1. Typical performance

Typical RF performance at Tcase = 25 C in a Doherty production test circuit.
1-carrier W-CDMA 2496 to 2690 28 32 14.5 43 30 [1]
NXP Semiconductors BLC8G27LS-160AV
Power LDMOS transistor
2. Pinning information

[1] Connected to flange.
3. Ordering information

4. Limiting values

[1] Continuous use at maximum temperature will affect the reliability.
5. Thermal characteristics

6. Characteristics


Table 2. Pinning
Table 3. Ordering information

BLC8G27LS-160AV- plastic earless flanged cavity package; 6 leads SOT1275
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage - 65 V
VGS gate-source voltage 0.5 +13 V
Tstg storage temperature 65 +150 C junction temperature [1]- 225 C
Table 5. Thermal characteristics

Rth(j-case) thermal resistance from junction to case Tcase =80 C; =W
K/W
NXP Semiconductors BLC8G27LS-160AV
Power LDMOS transistor
7. Test information
7.1 Ruggedness in Doherty operation


NXP Semiconductors BLC8G27LS-160AV
Power LDMOS transistor
8. Package outline Package outline SOT1275
NXP Semiconductors BLC8G27LS-160AV
Power LDMOS transistor
9. Handling information

10. Abbreviations

11. Revision history

Table 6. Abbreviations

3GPP 3rd Generation Partnership Project
CCDF Complementary Cumulative Distribution Function
DPCH Dedicated Physical CHannel
LDMOS Laterally Diffused Metal-Oxide Semiconductor
PAR Peak-to-Average Ratio
W-CDMA Wideband Code Division Multiple Access
Table 7. Revision history

BLC8G27LS-160AV 20130523 Objective data sheet - -
NXP Semiconductors BLC8G27LS-160AV
Power LDMOS transistor
12. Legal information
12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://.
12.2 Definitions
Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
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use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
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Product data sheet.
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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial
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No offer to sell or license — Nothing in this document may be interpreted or

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conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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