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BCP68STN/a84avaiNPN Transistor


BCP68 ,NPN TransistorTHERMAL CHARACTERISTICSDevice Package ShippingCharacteristic Symbol Max Unit BCP68T1 SOT−223−4 1000 ..
BCP68-10 ,General Purpose TransistorsCharacteristicsCollector-emitter breakdown voltage 20 - - VV(BR)CEOI = 30 mA, I = 0 C BCollector-em ..
BCP68-16 ,General Purpose TransistorsCharacteristics at T = 25°C, unless otherwise specified.AParameter Symbol Values Unitmin. typ. max.
BCP6825 ,NPN Silicon AF Transistor (For general AF application High collector current High current gain)General descriptionNPN medium power transistor series in Surface-Mounted Device (SMD) plastic packa ..
BCP68-25 ,NPN Silicon AF Transistor (For general AF application High collector current High current gain)General descriptionNPN medium power transistor series in Surface-Mounted Device (SMD) plastic packa ..
BCP68T1 ,MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNTELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)ACharacteristics Symbol Min Typ Max Uni ..
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BLA2AAG102SN4D , EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA2AA/BLA2AB Series (0804 Size)
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BLA2AAG121SN4D , EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA2AA/BLA2AB Series (0804 Size)
BLA2ABB121SN4D , EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA2AA/BLA2AB Series (0804 Size)


BCP68
NPN Transistor
BCP68T1
Preferred Device

NPN Silicon
Epitaxial Transistor
This NPN Silicon Epitaxial Transistor is designed for use in low
voltage, high current applications. The device is housed in the
SOT−223−4 package, which is designed for medium power surface
mount applications. High Current: IC = 1.0 A The SOT−223−4 Package can be soldered using wave or reflow. SOT−223−4 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die. Available in 12 mm Tape and Reel
Use BCP68T1 to order the 7 inch/1000 unit reel.
Use BCP68T3 to order the 13 inch/4000 unit reel. The PNP Complement is BCP69T1 Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
THERMAL CHARACTERISTICS
Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
MEDIUM POWER
NPN SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
2
COLLECTOR 2,4
BASE
EMITTER 3
http://
SOT−223−4 (TO−261)
CASE 318E

Style 1
ORDERING INFORMATION
= Specific Device Code
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MARKING
DIAGRAM
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