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BB182
VHF variable capacitance diode
Product profile1.1 General descriptionThe BB182 is a planar technology variable capacitance diode in a SOD523 (SC-79)
ultra small plastic package. The excellent matching performance is achieved by gliding
matching and a Direct Matching Assembly (DMA) procedure.
1.2 Features High linearity Excellent matching to 2 % DMA Ultra small plastic SMD package Cd(28V): 2.7 pF; Cd(1V) to Cd(28V) ratio: 22 Low series resistance
1.3 Applications Electronic tuning in VHF television tuners, Band A up to 160 MHz Voltage Controlled Oscillators (VCO)
Pinning information[1] The marking bar indicates the cathode.
Ordering information
BB182
VHF variable capacitance diode
Rev. 03 — 24 February 2009 Product data sheet
Table 1. Pinning cathode [1] anode
sym008
Table 2. Ordering informationBB182 SC-79 plastic surface-mounted package; 2 leads SOD523
NXP Semiconductors BB182
VHF variable capacitance diode Marking Limiting values Characteristics
Table 3. Marking codesBB182 2
Table 4. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). reverse voltage - 32 V
peak value in series with a 10 kΩ resistor - 35 V forward current - 20 mA
Tstg storage temperature −55 +150 °C junction temperature −55 +125 °C
Table 5. Characteristics reverse current see Figure2 =30V - - 10 nA =30V; Tj =85°C - - 200 nA diode series resistance f= 100 MHz at Cd=30pF - 1.0 1.2 Ω diode capacitance f=1 MHz; see Figure 1 and
Figure3=1V 52 - 62 pF=28V 2.48 2.7 2.89 pF
Cd(1V)/Cd(2V) diode capacitance ratio (1 V to 2V) f = 1 MHz - 1.31 -
Cd(1V)/Cd(28V) diode capacitance ratio (1 V to 28V) f = 1 MHz 20.6 22 -
Cd(25V)/Cd(28V) diode capacitance ratio (25 V to 28V) f = 1 MHz - 1.05 -
ΔCd/Cd diode capacitance matching VR=1Vto28V;ina sequence
of 10 diodes (gliding)
--2 %
NXP Semiconductors BB182
VHF variable capacitance diode
NXP Semiconductors BB182
VHF variable capacitance diode Package outline Abbreviations Revision history
Fig 4. Package outline SOD523 (SC-79)
Plastic surface-mounted package; 2 leads SOD523
Table 6. AbbreviationsSMD Surface-Mounted Device
VHF Very High Frequency
Table 7. Revision historyBB182_3 20090224 Product data sheet - BB182_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors
Legal texts have been adapted to the new company name where appropriate
BB182_2 20041103 Product data sheet - BB182_1
BB182_1 19971113 Product specification - -
NXP Semiconductors BB182
VHF variable capacitance diode
10. Legal information
10.1 Data sheet status[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The productstatus ofdevice(s) describedinthis documentmayhavechanged since thisdocumentwaspublishedandmay differincase ofmultiple devices.The latest productstatus
information is available on the Internet at URL http://.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included hereinand shall haveno liability forthe consequencesof
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
withthe same product type number(s)andtitle. Ashort data sheetis intended
forquickreferenceonlyand shouldnotbe relied uponto containdetailedand
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors doesnotgiveany representationsor
warranties,expressedor implied,asto theaccuracyor completenessof such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXPSemiconductors reservesthe rightto make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedesand replacesall informationsupplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings Systemof IEC60134) may cause permanent
damagetothe device. Limiting valuesare stress ratingsonly andoperationof
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale —NXP Semiconductors products are soldsubjecttothe general termsand conditionsof commercial sale,as published http:///profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance orimplicationofany license under anycopyrights, patents
or other industrial or intellectual property rights.
10.4 TrademarksNotice:All referenced brands, product names, service namesand trademarks
are the property of their respective owners.
11. Contact informationFor more information, please visit:
http://For sales office addresses, please send an email to:
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BB182
VHF variable capacitance diode
© NXP B.V. 2009. All rights reserved.For more information, please visit: http://
Pleasebe awarethat important notices concerningthis documentandthe product(s)
described herein, have been included in section ‘Legal information’.
12. Contents Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 4 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 510.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Contact information. . . . . . . . . . . . . . . . . . . . . . 5 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
