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BAV70ROHMN/a30000avaiSwitching Diodes
BAV70DXV6T1ONN/a3000avaiSmall Signal Switching Diodes in SOT563


BAV70 ,Switching DiodesTHERMAL CHARACTERISTICSN9 = Specific Device CodeCharacteristic D = Date Code(One Junction Heated)Sy ..
BAV70-7 , DUAL SURFACE MOUNT SWITCHING DIODE
BAV70-7 , DUAL SURFACE MOUNT SWITCHING DIODE
BAV70DW-7 , QUAD SURFACE MOUNT SWITCHING DIODE ARRAY
BAV70DXV6T1 ,Small Signal Switching Diodes in SOT563ELECTRICAL CHARACTERISTICS100 10T = 150°CAT = 85°CAT = 125°CA1.010T = -40°CAT = 85°CA0.1T = 55°C1. ..
BAV70LT1 ,Monolithic Dual Switching Diode Common Cathode2I , FORWARD CURRENT (mA)FC , DIODE CAPACITANCE (pF)DI , REVERSE CURRENTμ (A)RBAV70LT1INFORMATION F ..
BD3888FS , Audio sound processor for TV
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BD3941HFP , Reference Voltage Regulator
BD3951F , System Regulator (RESET, Vcc-Detection and 150mA LDO)
BD3987FV , Positive and Negative Variable Linear Regulator
BD3989FV , Positive and Negative Variable Linear Regulator


BAV70-BAV70DXV6T1
Small Signal Switching Diodes in SOT563
3I , FORWARD CURRENT (mA)FC , DIODE CAPACITANCE (pF)DI , REVERSE CURRENT (μA)RNSDEMN11XV6T1, NSDEMN11XV6T5INFORMATION FOR USING THE SOT-563 SURFACE MOUNT PACKAGEMINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the interface between the board and the package. With thetotal design. The footprint for the semiconductor packages correct pad geometry, the packages will self align whenmust be the correct size to insure proper solder connection subjected to a solder reflow process.0.30.01180.450.01771.00.03941.350.05310.5 0.50.0197 0.0197mm SCALE 20:1inchesSOT-563SOT-563 POWER DISSIPATIONSOLDERING PRECAUTIONSThe power dissipation of the SOT-563 is a function ofThe melting temperature of solder is higher than thethe pad size. This can vary from the minimum pad size forrated temperature of the device. When the entire device issoldering to a pad size given for maximum power dissipa-heated to a high temperature, failure to complete solderingtion. Power dissipation for a surface mount device is deter-within a short time could result in device failure. There-mined by T , the maximum rated junction temperatureJ(max)fore, the following items should always be observed inof the die, R , the thermal resistance from the deviceJAorder to minimize the thermal stress to which the devicesjunction to ambient, and the operating temperature, T .Aare subjected.Using the values provided on the data sheet for the• Always preheat the device.SOT-563 package, P can be calculated as follows:D• The delta temperature between the preheat andT - TJ(max) Asoldering should be 100°C or less.*P =DRJA• When preheating and soldering, the temperature of theThe values for the equation are found in the maximumleads and the case must not exceed the maximumratings table on the data sheet. Substituting these valuestemperature ratings as shown on the data sheet. Wheninto the equation for an ambient temperature T of 25°C,using infrared heating with the reflow solderingAone can calculate the power dissipation of the device whichmethod, the difference shall be a maximum of 10°C.in this case is 150 milliwatts.• The soldering temperature and time shall not exceed260°C for more than 10 seconds.150°C - 25°CP = = 150 milliwattsD• When shifting from preheating to soldering, the833°C/Wmaximum temperature gradient shall be 5°C or less.• After soldering has been completed, the device shouldThe 833°C/W for the SOT-563 package assumes the usebe allowed to cool naturally for at least three minutes.of the recommended footprint on a glass epoxy printedGradual cooling should be used as the use of forcedcircuit board to achieve a power dissipation of 150 milli-cooling will increase the temperature gradient andwatts. There are other alternatives to achieving higherresult in latent failure due to mechanical stress.power dissipation from the SOT-563 package. Anotheralternative would be to use a ceramic substrate or an • Mechanical stress or shock should not be appliedaluminum core board such as Thermal Clad . Using aduring cooling.board material such as Thermal Clad, an aluminum core* Soldering a device without preheating can cause exces-board, the power dissipation can be doubled using the samesive thermal shock and stress which can result in damagefootprint.to the device.
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