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BAT54AWFILMSTN/a21000avaiSMALL SIGNAL SCHOTTKY DIODE
BAT54CWFILMSTN/a12000avaiSMALL SIGNAL SCHOTTKY DIODE


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BAT54AWFILM-BAT54CWFILM
SMALL SIGNAL SCHOTTKY DIODE
BAT54J / W / AW / CW / SW
June 1999 - Ed: 2A
SMALL SIGNAL SCHOTTKY DIODE
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
SURFACE MOUNT DEVICE
FEATURES AND BENEFITS

Schottky barrier diodes encapsulated either in
SOT-323 or SOD-323 small SMD packages.
Single and double diodes with different pining are
available.
DESCRIPTION
Note 1: for double diodes, Ptot is the total dissipation of both diodes
ABSOLUTE RATINGS (limiting values)

* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/5
Pulse test : * tp = 380 μs, δ < 2%
** tp = 5 ms, δ < 2%
STATIC ELECTRICAL CHARACTERISTICS (per diode)
DYNAMIC CHARACTERISTICS (Tj = 25 °C)

(*) Mounted on epoxy board, with recommended pad layout.
THERMAL RESISTANCE

0.000.050.100.150.200.250.300.350.400.450.500.00E+0
2.00E-3
4.00E-3
6.00E-3
8.00E-3
1.00E-2
1.20E-2
1.40E-2
1.60E-2
1.80E-2
2.00E-2
IFM(A)
Fig. 1-1: Forward voltage drop versus forward

current (typical values, low level).
0.00.10.20.30.40.50.60.70.80.91.01.11E-3
1E-2
1E-1
5E-1
IFM(A)
Fig. 1-2: Forward voltage drop
versus forward
current (typical values, high level).
BAT54J / W / AW / CW / SW

2/5
5 10 15 20 25 30 35 40 45 50300Rth(j-a) (°C/W)
Fig. 6: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness: 35μm.) 5 10 15 20 25 301E-2
1E-1
1E+0
1E+1
1E+2
IR(μA)
Fig. 2: Reverse leakage current versus reverse

voltage applied (typical values). 25 50 75 100 125 1501E-2
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
IR(μA)
Fig. 3: Reverse leakage current versus
junction
temperature. 5 10 20 301
C(pF)
Fig. 4:
Junction capacitance versus reverse
voltage applied (typical values).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+20.01
Zth(j-a)/Rth(j-a)
Fig. 5: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
FR4 with recommended pad layout, e(Cu)=35μm)
BAT54J / W / AW / CW / SW

3/5
PACKAGE MECHANICAL DATA
SOT-323
BAT54J / W / AW / CW / SW

4/5
PACKAGE MECHANICAL DATA
SOD-323
Epoxy meets UL94,V0
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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