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BAL-2593D5U
50 / 50+j50 Balun transformer for 2.45 GHz ISM band
October 2009 Doc ID 16008 Rev 1 1/8
BAL-2593D5U50 / 50+j50 balun transformer for 2.45 GHz ISM band
Features 50 Ω nominal Input / 50+j50 output differential
impedance Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint: BAL-2593D5U < 1.5 mm²
Benefits Very low profile (<700 µm) High RF performances RF components count and area reduction
Application Bluetooth balun for STL2592/2593/2500D
transceiver Portable applications
DescriptionThe BAL-2593D5U is a balun designed to
transform a single ended signal to differential
signals in Bluetooth applications.
This BAL-2593D5U, with less than 1.2 dB
insertion losses in the bandwidth 2400 MHz to
2500 MHz, has been customized for
STLC2592/2593/2500D Bluetooth transceivers
and specific requirements for SCC22 parameter at
2f0 (4.88 GHz).
The BAL-2593D5U has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non conductive glass
substrate to optimize RF performances.
Figure 1. Top view
Figure 2. Application schematic
TM: IPAD is a trademark of STMicroelectronics.
Electrical characteristics BAL-2593D5U2/8 Doc ID 16008 Rev 1
1 Electrical characteristics
Table 1. Absolute maximum ratings (limiting values)
Table 2. Electrical characteristics (Tamb = 25 °C) impedances
Table 3. RF performance (Tamb = 25 °C)
BAL-2593D5U Electrical characteristicsDoc ID 16008 Rev 1 3/8
Figure 3. Insertion loss (Tamb= 25 °C) Figure 4. Return loss (Tamb= 25 °C)
Figure 5. Amplitude imbalance (T amb = 25 °C) Figure 6. Phase imbalance (T amb = 25 °C)
Figure 7. S dd22 @ f0 (T amb = 25 °C),
freq (2.4000 GHz to 2.500 GHz)
Figure 8. S cc22 @ 2f0 (T amb = 25 °C),
freq (4.8000 GHz to 5.000 GHz)
Electrical characteristics BAL-2593D5U4/8 Doc ID 16008 Rev 1
Figure 9. Recommend land pattern (used for balun characterization)
Figure 10. Example of transceiver application board land pattern
BAL-2593D5U Package informationDoc ID 16008 Rev 1 5/8
2 Package information Epoxy meets UL94, V0 Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Figure 11. Package dimensions (definitions)
Table 4. Package dimensions (values)
Package information BAL-2593D5U6/8 Doc ID 16008 Rev 1
Note: More packing information is available in the applications note:
AN 2348: “Flip Chip: package description and recommendations for use”
Figure 12. Footprint Figure 13. Marking
